PTO
Wrapper
PDF
Dossier
Espace
Google
Patent
D592030
Priority
Oct 26 2004
Filed
Sep 25 2007
Issued
May 12 2009
Expiry
May 12 2023
Assg.orig
Entity
unknown
31
61
n/a
The ornamental design for a polishing pad , as shown and described.
FIG. 1 is a top plan view of a polishing pad showing our new design;
FIG. 2 is a front elevational view thereof, the rear elevational view, left side and front side elevational views thereof being mirror images of the views shown;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a partially enlarged view of portion 4 —4 in FIG. 1 ;
FIG. 5 is a partially enlarged sectional view taken substantially along line 5 —5 in FIG. 4 ;
FIG. 6 is a partially enlarged sectional view taken substantially along line 6 —6 in FIG. 4 ;
FIG. 7 is a partially enlarged drawing of portion 7 —7 in FIG. 3 ;
FIG. 8 is a partially enlarged sectional view of portion 8 in FIG. 5 ; and,
FIG. 9 is a partially enlarged view of section 9 —9 in FIG. 1 .
Shiho, Hiroshi , Tano, Hiroyuki
Patent
Priority
Assignee
Title
10011999 ,
Sep 18 2014
HUSQVARNA AB
Method for finishing a surface using a grouting pan
10246885 ,
Sep 18 2014
HUSQVARNA AB
Grouting pan assembly with reinforcement ring
10414012 ,
Jan 13 2017
HUSQVARNA AB
Grinding pad apparatus
10667665 ,
Sep 24 2015
HUSQVARNA AB
Method of using polishing or grinding pad assembly
10710214 ,
Jan 11 2018
DIAMOND TOOL SUPPLY, INC
Polishing or grinding pad with multilayer reinforcement
11084140 ,
Sep 24 2015
HUSQVARNA AB
Method of using polishing or grinding pad assembly
9180570 ,
Mar 14 2008
CMC MATERIALS LLC
Grooved CMP pad
D678745 ,
Jul 07 2011
Spinning insert polishing pad
D795666 ,
Jun 06 2014
HUSQVARNA AB
Polishing pad
D837015 ,
Jun 06 2014
HUSQVARNA AB
Polishing pad
D852601 ,
Apr 24 2017
EHWA DIAMOND IND CO , LTD
Polishing pad
D854902 ,
Sep 23 2016
HUSQVARNA AB
Polishing or grinding pad
D873108 ,
Jun 06 2014
HUSQVARNA AB
Polishing pad
D873782 ,
May 17 2016
Electro Scientific Industries, Inc
Component carrier plate
D894137 ,
Oct 05 2017
Applied Materials, Inc.
Target profile for a physical vapor deposition chamber target
D902165 ,
Mar 09 2018
Applied Materials, Inc.
Target profile for a physical vapor deposition chamber target
D908645 ,
Aug 26 2019
Applied Materials, Inc
Sputtering target for a physical vapor deposition chamber
D919396 ,
Aug 30 2017
HUSQVARNA AB
Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
D927952 ,
Aug 30 2017
HUSQVARNA AB
Polishing or grinding pad assembly with abrasive disk, spacer, reinforcement and pad
D933440 ,
Sep 23 2016
HUSQVARNA AB
Polishing or grinding pad
D933725 ,
Feb 08 2019
Applied Materials, Inc
Deposition ring for a substrate processing chamber
D937329 ,
Mar 23 2020
Applied Materials, Inc
Sputter target for a physical vapor deposition chamber
D940765 ,
Dec 02 2020
Applied Materials, Inc
Target profile for a physical vapor deposition chamber target
D941371 ,
Mar 20 2020
Applied Materials, Inc
Process shield for a substrate processing chamber
D941372 ,
Mar 20 2020
Applied Materials, Inc
Process shield for a substrate processing chamber
D942516 ,
Feb 08 2019
Applied Materials, Inc
Process shield for a substrate processing chamber
D946638 ,
Dec 11 2017
Applied Materials, Inc.
Target profile for a physical vapor deposition chamber target
D958626 ,
Aug 30 2017
HUSQVARNA AB
Polishing or grinding pad assembly with abrasive disks, reinforcement and pad
D966357 ,
Dec 02 2020
Applied Materials, Inc.
Target profile for a physical vapor deposition chamber target
D970566 ,
Mar 23 2020
Applied Materials, Inc.
Sputter target for a physical vapor deposition chamber
ER6877 ,
Patent
Priority
Assignee
Title
4693036 ,
Dec 28 1983
Disco Abrasive Systems, Ltd.
Semiconductor wafer surface grinding apparatus
494471 ,
5007207 ,
Dec 22 1987
Abrasive product
5400547 ,
Feb 28 1992
Shin-Etsu Handotai Co., Ltd.
Polishing machine and method of dissipating heat therefrom
5718620 ,
Feb 28 1992
Shin-Etsu Handotai
Polishing machine and method of dissipating heat therefrom
5851140 ,
Feb 13 1997
Novellus Systems, Inc
Semiconductor wafer polishing apparatus with a flexible carrier plate
5899799 ,
Jan 19 1996
Micron Technology, Inc
Method and system to increase delivery of slurry to the surface of large substrates during polishing operations
5921855 ,
May 15 1997
Applied Materials, Inc
Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
5984769 ,
May 15 1997
Applied Materials, Inc
Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
6033293 ,
Oct 08 1997
THE CHASE MANHATTAN BANK, AS COLLATERAL AGENT
Apparatus for performing chemical-mechanical polishing
6056632 ,
Feb 13 1997
Novellus Systems, Inc
Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
6089966 ,
Nov 25 1997
SPEEDFAM CO , LTD
Surface polishing pad
6220942 ,
Apr 02 1999
Applied Materials, Inc.; Applied Materials, Inc
CMP platen with patterned surface
6332830 ,
Aug 04 1998
Shin-Etsu Handotai Co., Ltd.
Polishing method and polishing device
6402594 ,
Jan 18 1999
Shin-Etsu Handotai Co., Ltd.
Polishing method for wafer and holding plate
6422922 ,
Feb 12 1999
Shin-Etsu Handotai Co., Ltd.
Workpiece holder for polishing, apparatus for polishing workpiece and method for polishing workpiece
6517417 ,
Feb 25 2000
Rohm and Haas Electronic Materials CMP Holdings, Inc
Polishing pad with a transparent portion
6520847 ,
May 15 1997
Applied Materials, Inc.
Polishing pad having a grooved pattern for use in chemical mechanical polishing
6592438 ,
Apr 02 1999
Applied Materials Inc.
CMP platen with patterned surface
6645061 ,
May 15 1997
Applied Materials, Inc.
Polishing pad having a grooved pattern for use in chemical mechanical polishing
6824447 ,
Dec 27 2002
Rohm and Haas Electronic Materials CMP Holdings, Inc
Perforated-transparent polishing pad
6837780 ,
Nov 19 1998
LAM-PLAN S A
Lapping and polishing device
6986706 ,
Aug 10 2004
Universal Photonics, Inc.
Polishing pad and method of producing the same
7029747 ,
Sep 17 2002
Korea Polyol Co., Ltd.
Integral polishing pad and manufacturing method thereof
7112119 ,
Aug 26 2005
Applied Materials, Inc.
Sealed polishing pad methods
7121938 ,
Apr 03 2002
Toho Engineering Kabushiki Kaisha
Polishing pad and method of fabricating semiconductor substrate using the pad
7183213 ,
Jul 17 2003
JSR Corporation
Chemical mechanical polishing pad and chemical mechanical polishing method
88649 ,
20010005667 ,
20010034198 ,
20020137450 ,
20030092371 ,
20040053566 ,
20040072516 ,
20040082271 ,
20040127145 ,
20040259483 ,
20050113011 ,
20050142996 ,
20050148183 ,
20050191945 ,
20050211376 ,
20050245171 ,
20060037699 ,
20060063471 ,
20060229002 ,
20060276109 ,
20070049167 ,
20080003935 ,
D376744 ,
Aug 03 1994
Gerd Eisenblatter GmbH
Support plate
D490827 ,
Dec 20 2002
NGK SPARK PLUG CO , LTD
Electrostatic chuck
D510850 ,
Dec 20 2002
Production Chemical Mfg. Inc.
Polishing pad
D559063 ,
Mar 17 2004
JSR Corporation
Polishing pad
D559064 ,
Mar 17 2004
JSR Corporation
Polishing pad
D559065 ,
Oct 05 2004
JSR Corporation
Polishing pad
D559066 ,
Oct 26 2004
JSR Corporation
Polishing pad
D559648 ,
Oct 05 2004
JRS Corporation
Polishing pad
D576855 ,
Mar 17 2004
JSR Corporation
Polishing pad
D581237 ,
Mar 17 2004
JSR Corporation
Polishing pad
JP115633 ,
JP1156872 ,
Executed on Assignor Assignee Conveyance Frame Reel Doc
Sep 25 2007 JSR Corporation (assignment on the face of the patent) /
Date
Maintenance Fee Events
n/a
Date
Maintenance Schedule
n/a