Patent
   D942516
Priority
Feb 08 2019
Filed
Feb 08 2019
Issued
Feb 01 2022
Expiry
Feb 01 2037
Assg.orig
Entity
unknown
3
51
n/a
The ornamental design for a process shield for a substrate processing chamber, as shown and described.

FIG. 1 is a top isometric view of a process shield for a substrate processing chamber, according to one embodiment of the novel design.

FIG. 2 is a bottom isometric view thereof.

FIG. 3 is a bottom plan view thereof.

FIG. 4 is a top plan view thereof.

FIG. 5 is a front elevation view thereof.

FIG. 6 is a back elevation view thereof.

FIG. 7 is a left side elevation view thereof.

FIG. 8 is a right side elevation view thereof.

FIG. 9 is cross-sectional view taken along line 9-9 of FIG. 3.

FIG. 10 is a top isometric view of a process shield for a substrate processing chamber, according to another embodiment of the novel design.

FIG. 11 is a bottom isometric view thereof.

FIG. 12 is a bottom plan view thereof.

FIG. 13 is a top plan view thereof.

FIG. 14 is a front elevation view thereof.

FIG. 15 is a back elevation view thereof.

FIG. 16 is a left side elevation view thereof.

FIG. 17 is a right side elevation view thereof.

FIG. 18 is cross-sectional view taken along line 18-18 of FIG. 12; and,

FIG. 19 is cross-sectional view taken along line 19-19 of FIG. 14.

The dashed lines in FIGS. 1-19 represent unclaimed environment forming no part of the claimed design.

Sansoni, Steven V., Koppa, Manjunatha P., Kamath, Aravind, Tsai, Cheng-Hsiung Matt, Venkataswamappa, Manjunath H., Or, David

Patent Priority Assignee Title
D973609, Apr 22 2020 Applied Materials, Inc Upper shield with showerhead for a process chamber
D984895, Dec 22 2020 Applied Materials, Inc Packaging insert for a process chamber component
D986190, Mar 19 2020 Applied Materials, Inc. Confinement plate for a substrate processing chamber
Patent Priority Assignee Title
5320728, Mar 30 1990 Applied Materials, Inc. Planar magnetron sputtering source producing improved coating thickness uniformity, step coverage and step coverage uniformity
8043487, Dec 12 2008 FUJIFILM Corporation Chamber shield for vacuum physical vapor deposition
8371904, Aug 08 2008 CHARTERED SEMICONDUCTOR MANUFACTURING PTE LTD ; GLOBALFOUNDRIES SINGAPORE PTE LTD Polishing with enhanced uniformity
9475996, Oct 17 2012 Centrifugal fluid ring plasma reactor
20030029564,
20120263569,
20150357169,
20170009367,
20200090915,
D351450, May 19 1993 RITEFLITE PTY LIMITED Target for shooting
D376744, Aug 03 1994 Gerd Eisenblatter GmbH Support plate
D381030, Nov 21 1995 Applied Materials, Inc Sputtering target
D395483, Jun 07 1996 Riteflite Pty Limited Design for a target
D401252, Jan 27 1998 Semiconductor Equipment Technology Shield and cover for target of sputter coating apparatus
D403002, Jan 27 1998 Semiconductor Equipment Technology, Inc. Shield and cover for target of sputter coating apparatus
D403334, Jan 27 1998 Semiconductor Equipment Technology, Inc Shield and cover for target of sputter coating apparatus
D403337, Aug 05 1997 Applied Materials, Inc.; Applied Materials, Inc High conductance low wall deposition upper shield
D491963, Nov 20 2002 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
D559066, Oct 26 2004 JSR Corporation Polishing pad
D584591, Oct 26 2004 JSR Corporation Polishing pad
D592029, Oct 26 2004 JSR Corporation Polishing pad
D592030, Oct 26 2004 JSR Corporation Polishing pad
D600989, Oct 26 2004 JSR Corporation Polishing pad
D616389, Oct 20 2008 Ebara Corporation Vacuum contact pad
D665491, Jan 25 2012 Applied Materials, Inc. Deposition chamber cover ring
D678745, Jul 07 2011 Spinning insert polishing pad
D703162, Oct 17 2012 Sumitomo Electric Industries, Ltd. Wafer holder for stepper
D738451, Nov 11 2014 Golf ball target for chipping and putting
D741823, Jul 10 2013 KOKUSAI ELECTRIC CORPORATION Vaporizer for substrate processing apparatus
D741921, Apr 15 2014 Q-LINEA AB Positive mold for manufacturing a sample holding disc
D795208, Aug 18 2015 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
D796458, Jan 08 2016 ASM IP Holding B.V. Gas flow control plate for semiconductor manufacturing apparatus
D810705, Apr 01 2016 VEECO INSTRUMENTS, INC Self-centering wafer carrier for chemical vapor deposition
D819580, Apr 01 2016 VEECO INSTRUMENTS, INC Self-centering wafer carrier for chemical vapor deposition
D877101, Mar 09 2018 Applied Materials, Inc Target profile for a physical vapor deposition chamber target
D888903, Dec 17 2018 Applied Materials, Inc Deposition ring for physical vapor deposition chamber
D891382, Feb 08 2019 Applied Materials, Inc Process shield for a substrate processing chamber
D913979, Aug 28 2019 Applied Materials, Inc Inner shield for a substrate processing chamber
D913980, Feb 01 2018 ASM IP Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
JP1481081,
JP1509910,
JP1549498,
JP1570910,
JP1575876,
JP1584875,
JP1584906,
TW161030,
TW166431,
TW166552,
TW167109,
TW187432,
///////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 08 2019Applied Materials, Inc.(assignment on the face of the patent)
Feb 20 2019KOPPA, MANJUNATHA P Applied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0486130571 pdf
Feb 20 2019H V, MANJUNATHApplied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0486130571 pdf
Feb 20 2019SANSONI, STEVEN V Applied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0486130571 pdf
Feb 20 2019OR, DAVIDApplied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0486130571 pdf
Feb 25 2019KAMATH, ARAVINDApplied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0486130571 pdf
Feb 25 2019TSAI, CHENG-HSIUNG MATTApplied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0486130571 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule