FIG. 1 is a top isometric view of a first embodiment of an upper shield with showerhead for a process chamber.
FIG. 2 is a top plan view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a front elevation view thereof.
FIG. 5 is a back elevation view thereof.
FIG. 6 is a left elevation view thereof.
FIG. 7 is a right elevation view thereof.
FIG. 8 is cross-sectional elevation view thereof, taken along line 8-8 of FIG. 2.
FIG. 9 is a top isometric view of a second embodiment of an upper shield with showerhead for a process chamber.
FIG. 10 is a top plan view thereof.
FIG. 11 is a bottom plan view thereof.
FIG. 12 is a front elevation view thereof.
FIG. 13 is a back elevation view thereof.
FIG. 14 is a left elevation view thereof.
FIG. 15 is a right elevation view thereof; and,
FIG. 16 is cross-sectional elevation view thereof, taken along line 16-16 of FIG. 10.
The dashed lines in FIGS. 1-16 represent unclaimed environment forming no part of the claimed design.
Patent |
Priority |
Assignee |
Title |
10577689, |
Sep 23 2016 |
Applied Materials, Inc |
Sputtering showerhead |
5762748, |
Aug 27 1992 |
Applied Materials, Inc |
Lid and door for a vacuum chamber and pretreatment therefor |
7981262, |
Jan 29 2007 |
Applied Materials, Inc |
Process kit for substrate processing chamber |
9728380, |
Aug 31 2012 |
Novellus Systems, Inc. |
Dual-plenum showerhead with interleaved plenum sub-volumes |
9865437, |
Dec 30 2014 |
Applied Materials, Inc |
High conductance process kit |
20040149216, |
|
|
|
20070034337, |
|
|
|
20100291319, |
|
|
|
20120305190, |
|
|
|
20210335581, |
|
|
|
20220223367, |
|
|
|
D557425, |
Aug 25 2005 |
HITACHI HIGH-TECH CORPORATION |
Cover ring for a plasma processing apparatus |
D642605, |
Apr 02 2010 |
Applied Materials, Inc |
Lid assembly for a substrate processing chamber |
D703160, |
Jan 27 2011 |
HITACHI HIGH-TECH CORPORATION |
Grounded electrode for a plasma processing apparatus |
D734730, |
Dec 27 2012 |
KOKUSAI ELECTRIC CORPORATION |
Boat of substrate processing apparatus |
D789310, |
Nov 20 2014 |
Tokyo Electron Limited |
Wafer boat |
D802790, |
Jun 12 2015 |
HITACHI HIGH-TECH CORPORATION |
Cover ring for a plasma processing apparatus |
D804436, |
Jun 12 2015 |
HITACHI HIGH-TECH CORPORATION |
Upper chamber for a plasma processing apparatus |
D827592, |
Jan 31 2017 |
HITACHI HIGH-TECH CORPORATION |
Electrode cover for a plasma processing apparatus |
D891382, |
Feb 08 2019 |
Applied Materials, Inc |
Process shield for a substrate processing chamber |
D913979, |
Aug 28 2019 |
Applied Materials, Inc |
Inner shield for a substrate processing chamber |
D933725, |
Feb 08 2019 |
Applied Materials, Inc |
Deposition ring for a substrate processing chamber |
D940765, |
Dec 02 2020 |
Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D941371, |
Mar 20 2020 |
Applied Materials, Inc |
Process shield for a substrate processing chamber |
D941372, |
Mar 20 2020 |
Applied Materials, Inc |
Process shield for a substrate processing chamber |
D942516, |
Feb 08 2019 |
Applied Materials, Inc |
Process shield for a substrate processing chamber |
D946638, |
Dec 11 2017 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
TW198930, |
|
|
|
TW198931, |
|
|
|
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 22 2020 | | Applied Materials, Inc. | (assignment on the face of the patent) | | / |
Apr 23 2020 | WADA, YUICHI | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 052700 | /0822 |
pdf |
Apr 23 2020 | BABU, SARATH | APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 052701 | /0026 |
pdf |
Apr 23 2020 | OW, YUEH SHENG | APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 052701 | /0026 |
pdf |
Apr 23 2020 | WEI, JUNQI | APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 052701 | /0026 |
pdf |
Apr 23 2020 | BOH, KELVIN TAI MING | APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 052701 | /0026 |
pdf |
Apr 23 2020 | ZHANG, KANG | APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 052701 | /0026 |
pdf |
May 14 2020 | JUPUDI, ANANTHKRISHNA | APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 052701 | /0026 |
pdf |
Jan 22 2021 | APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 055145 | /0094 |
pdf |