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Patent
   D557425
Priority
Aug 25 2005
Filed
Aug 25 2005
Issued
Dec 11 2007
Expiry
Dec 11 2021
Inventors
Nakamura, …
Assg.orig
Hitachi Hi…
Assg.curr
HITACHI HI…
Entity
unknown
Referenced by
31
References
13
Maint.:
n/a
We claim the ornamental design for cover ring for a plasma processing apparatus, as shown.

FIG. 1 is a front, top and right side perspective view of cover ring for a plasma processing apparatus showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a top plan elevational view thereof;

FIG. 6 is a rear elevational view thereof; and,

FIG. 7 is a bottom plan elevational view thereof.
INVENTORS:

Nakamura, Tsutomu, Makino, Akitaka, Tauchi, Susumu

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D802790, Jun 12 2015 HITACHI HIGH-TECH CORPORATION Cover ring for a plasma processing apparatus
D827592, Jan 31 2017 HITACHI HIGH-TECH CORPORATION Electrode cover for a plasma processing apparatus
D836573, Jan 31 2017 HITACHI HIGH-TECH CORPORATION Ring for a plasma processing apparatus
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D840365, Jan 31 2017 HITACHI HIGH-TECH CORPORATION Cover ring for a plasma processing apparatus
D907593, Jan 20 2017 HITACHI HIGH-TECH CORPORATION Discharge chamber for a plasma processing apparatus
D913979, Aug 28 2019 Applied Materials, Inc Inner shield for a substrate processing chamber
D925481, Dec 06 2018 KOKUSAI ELECTRIC CORPORATION Inlet liner for substrate processing apparatus
D931241, Aug 28 2019 Applied Materials, Inc Lower shield for a substrate processing chamber
D971167, Aug 28 2019 Applied Materials, Inc. Lower shield for a substrate processing chamber
D973609, Apr 22 2020 Applied Materials, Inc Upper shield with showerhead for a process chamber
ER5584,
ER8873,
ER8981,
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
6068441, Nov 21 1997 ASM America, Inc Substrate transfer system for semiconductor processing equipment
6423175, Oct 06 1999 Taiwan Semiconductor Manufacturing Co., Ltd Apparatus and method for reducing particle contamination in an etcher
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D404372, Aug 20 1997 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
D490450, May 20 2002 Tokyo Electron Limited Exhaust ring for semiconductor equipment
D491963, Nov 20 2002 Tokyo Electron Limited Inner wall shield for a process chamber for manufacturing semiconductors
D494552, Dec 12 2002 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
D496008, Dec 12 2002 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
ASSIGNMENT RECORDS    Assignment records on the USPTO
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 03 2005NAKAMURA, TSUTOMUHitachi High-Technologies CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0169290382 pdf
Aug 03 2005TAUCHI, SUSUMUHitachi High-Technologies CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0169290382 pdf
Aug 03 2005MAKINO, AKITAKAHitachi High-Technologies CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0169290382 pdf
Aug 25 2005Hitachi High-Technologies Corporation(assignment on the face of the patent)
Feb 12 2020Hitachi High-Technologies CorporationHITACHI HIGH-TECH CORPORATIONCHANGE OF NAME AND ADDRESS0522590227 pdf
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