PTO
Wrapper
PDF
Dossier
Espace
Google
Patent
D931241
Priority
Aug 28 2019
Filed
Aug 28 2019
Issued
Sep 21 2021
Expiry
Sep 21 2036
TERM.DISCL.
Assg.orig
Entity
unknown
2
28
n/a
The ornamental design for a lower shield for a substrate processing chamber, as shown and described.
FIG. 1 is a top isometric view of a lower shield for a substrate processing chamber, according to the novel design.
FIG. 2 is a top plan view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a front elevation view thereof.
FIG. 5 is a back elevation view thereof.
FIG. 6 is a right side elevation view thereof.
FIG. 7 is a left side elevation view thereof; and,
FIG. 8 is a cross-section view taken along line 8 -8 in FIG. 2 .
The dashed lines in FIGS. 1-8 are for the purpose of showing environmental structure, and form no part of the claimed design.
Zhang, Kang , Wada, Yuichi , Jupudi, Ananthkrishna , Ow, Yueh Sheng , Wei, Junqi , Boh, Kelvin , Babu, Sarath
Patent
Priority
Assignee
Title
9865437 ,
Dec 30 2014
Applied Materials, Inc
High conductance process kit
20020170881 ,
20040149216 ,
20070113783 ,
20100291319 ,
20110108524 ,
20180061618 ,
D557425 ,
Aug 25 2005
HITACHI HIGH-TECH CORPORATION
Cover ring for a plasma processing apparatus
D642605 ,
Apr 02 2010
Applied Materials, Inc
Lid assembly for a substrate processing chamber
D703160 ,
Jan 27 2011
HITACHI HIGH-TECH CORPORATION
Grounded electrode for a plasma processing apparatus
D716239 ,
Nov 06 2013
Applied Materials, Inc
Upper chamber liner
D802790 ,
Jun 12 2015
HITACHI HIGH-TECH CORPORATION
Cover ring for a plasma processing apparatus
D804436 ,
Jun 12 2015
HITACHI HIGH-TECH CORPORATION
Upper chamber for a plasma processing apparatus
D812578 ,
Feb 26 2016
HITACHI HIGH-TECH CORPORATION
Upper chamber for a plasma processing apparatus
D827592 ,
Jan 31 2017
HITACHI HIGH-TECH CORPORATION
Electrode cover for a plasma processing apparatus
D830981 ,
Apr 07 2017
ASM IP HOLDING B V ; ASM IP Holding B.V.
Susceptor for semiconductor substrate processing apparatus
D840364 ,
Jan 31 2017
HITACHI HIGH-TECH CORPORATION
Electrode cover for a plasma processing apparatus
D840365 ,
Jan 31 2017
HITACHI HIGH-TECH CORPORATION
Cover ring for a plasma processing apparatus
D855027 ,
Jan 22 2018
KOKUSAI ELECTRIC CORPORATION
Cover of seal cap for reaction chamber of semiconductor
D872037 ,
Aug 09 2017
KOKUSAI ELECTRIC CORPORATION
Cover of seal cap for reaction chamber for semiconductor manufacturing
D891382 ,
Feb 08 2019
Applied Materials, Inc
Process shield for a substrate processing chamber
D893441 ,
Jun 28 2019
Applied Materials, Inc
Base plate for a processing chamber substrate support
JP1328350 ,
JP2006060073 ,
TW132339 ,
TW167109 ,
TW179672 ,
WO2014014566 ,
Executed on Assignor Assignee Conveyance Frame Reel Doc
Aug 28 2019 Applied Materials, Inc. (assignment on the face of the patent) /
Aug 30 2019 WADA, YUICHI Applied Materials, Inc ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 050294 /0307
pdf
Sep 25 2019 BABU, SARATH APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF INVENTOR ZHANG KANG PREVIOUSLY RECORDED ON REEL 050866 FRAME 0235 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT 052352 /0191
pdf
Sep 25 2019 KANG, ZHANG APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 050866 /0235
pdf
Sep 25 2019 ZHANG, KANG APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF INVENTOR ZHANG KANG PREVIOUSLY RECORDED ON REEL 050866 FRAME 0235 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT 052352 /0191
pdf
Sep 25 2019 BABU, SARATH APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 050866 /0235
pdf
Sep 26 2019 BOH, KELVIN APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 050866 /0235
pdf
Sep 26 2019 BOH, KELVIN APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF INVENTOR ZHANG KANG PREVIOUSLY RECORDED ON REEL 050866 FRAME 0235 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT 052352 /0191
pdf
Sep 26 2019 WEI, JUNQI APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF INVENTOR ZHANG KANG PREVIOUSLY RECORDED ON REEL 050866 FRAME 0235 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT 052352 /0191
pdf
Sep 26 2019 JUPUDI, ANANTHKRISHNA APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF INVENTOR ZHANG KANG PREVIOUSLY RECORDED ON REEL 050866 FRAME 0235 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT 052352 /0191
pdf
Sep 26 2019 JUPUDI, ANANTHKRISHNA APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 050866 /0235
pdf
Sep 26 2019 WEI, JUNQI APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 050866 /0235
pdf
Oct 04 2019 OW, YUEH SHENG APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF INVENTOR ZHANG KANG PREVIOUSLY RECORDED ON REEL 050866 FRAME 0235 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT 052352 /0191
pdf
Oct 04 2019 OW, YUEH SHENG APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 050866 /0235
pdf
Jun 12 2020 APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE LTD Applied Materials, Inc ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 053444 /0044
pdf
Date
Maintenance Fee Events
n/a
Date
Maintenance Schedule
n/a