Patent
   D931241
Priority
Aug 28 2019
Filed
Aug 28 2019
Issued
Sep 21 2021
Expiry
Sep 21 2036

TERM.DISCL.
Assg.orig
Entity
unknown
0
28
n/a
The ornamental design for a lower shield for a substrate processing chamber, as shown and described.

FIG. 1 is a top isometric view of a lower shield for a substrate processing chamber, according to the novel design.

FIG. 2 is a top plan view thereof.

FIG. 3 is a bottom plan view thereof.

FIG. 4 is a front elevation view thereof.

FIG. 5 is a back elevation view thereof.

FIG. 6 is a right side elevation view thereof.

FIG. 7 is a left side elevation view thereof; and,

FIG. 8 is a cross-section view taken along line 8-8 in FIG. 2.

The dashed lines in FIGS. 1-8 are for the purpose of showing environmental structure, and form no part of the claimed design.

Zhang, Kang, Wada, Yuichi, Jupudi, Ananthkrishna, Ow, Yueh Sheng, Wei, Junqi, Boh, Kelvin, Babu, Sarath

Patent Priority Assignee Title
Patent Priority Assignee Title
9865437, Dec 30 2014 Applied Materials, Inc High conductance process kit
20020170881,
20040149216,
20070113783,
20100291319,
20110108524,
20180061618,
D557425, Aug 25 2005 HITACHI HIGH-TECH CORPORATION Cover ring for a plasma processing apparatus
D642605, Apr 02 2010 Applied Materials, Inc Lid assembly for a substrate processing chamber
D703160, Jan 27 2011 HITACHI HIGH-TECH CORPORATION Grounded electrode for a plasma processing apparatus
D716239, Nov 06 2013 Applied Materials, Inc Upper chamber liner
D802790, Jun 12 2015 HITACHI HIGH-TECH CORPORATION Cover ring for a plasma processing apparatus
D804436, Jun 12 2015 HITACHI HIGH-TECH CORPORATION Upper chamber for a plasma processing apparatus
D812578, Feb 26 2016 HITACHI HIGH-TECH CORPORATION Upper chamber for a plasma processing apparatus
D827592, Jan 31 2017 HITACHI HIGH-TECH CORPORATION Electrode cover for a plasma processing apparatus
D830981, Apr 07 2017 ASM IP HOLDING B V ; ASM IP Holding B.V. Susceptor for semiconductor substrate processing apparatus
D840364, Jan 31 2017 HITACHI HIGH-TECH CORPORATION Electrode cover for a plasma processing apparatus
D840365, Jan 31 2017 HITACHI HIGH-TECH CORPORATION Cover ring for a plasma processing apparatus
D855027, Jan 22 2018 KOKUSAI ELECTRIC CORPORATION Cover of seal cap for reaction chamber of semiconductor
D872037, Aug 09 2017 KOKUSAI ELECTRIC CORPORATION Cover of seal cap for reaction chamber for semiconductor manufacturing
D891382, Feb 08 2019 Applied Materials, Inc Process shield for a substrate processing chamber
D893441, Jun 28 2019 Applied Materials, Inc Base plate for a processing chamber substrate support
JP1328350,
JP2006060073,
TW132339,
TW167109,
TW179672,
WO2014014566,
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