FIG. 1 is a top perspective view of an upper chamber liner showing our new design;
FIG. 2 is another perspective view thereof;
FIG. 3 is a bottom perspective thereof;
FIG. 4 is another perspective view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a side view thereof;
FIG. 8 is another side view thereof;
FIG. 9 is another side view thereof;
FIG. 10 is a cross sectional view taken along line 10-10 in FIG. 5;
FIG. 11 is an enlarged portion view taken along lines 11-11 in FIG. 10; and,
FIG. 12 is an enlarged portion view taken along lines 12-12 in FIG. 10.
The broken lines in the figures form no part of the claimed design.
The upper chamber liner is shown broken away in FIGS. 11 and 12 to indicate that no particular length is claimed.
All surfaces not shown, form no part of the claimed design.
Patent |
Priority |
Assignee |
Title |
4340462, |
Feb 13 1981 |
LAM RESEARCH CORPORATION A CORP OF DELAWARE |
Adjustable electrode plasma processing chamber |
6170429, |
Sep 30 1998 |
Lam Research Corporation |
Chamber liner for semiconductor process chambers |
6277237, |
Sep 30 1998 |
Lam Research Corporation |
Chamber liner for semiconductor process chambers |
6884297, |
Mar 31 2003 |
WONIK IPS CO , LTD |
Thin film deposition reactor |
7011039, |
Jul 07 2000 |
Applied Materials, Inc |
Multi-purpose processing chamber with removable chamber liner |
7234412, |
Apr 11 2002 |
Micron Technology, Inc. |
Semiconductor substrate deposition processor chamber liner apparatus |
7942969, |
May 30 2007 |
Applied Materials, Inc. |
Substrate cleaning chamber and components |
7987814, |
Apr 07 2008 |
Applied Materials, Inc.; Applied Materials, Inc |
Lower liner with integrated flow equalizer and improved conductance |
8118938, |
Apr 07 2008 |
Applied Materials, Inc. |
Lower liner with integrated flow equalizer and improved conductance |
8282736, |
Apr 07 2008 |
Applied Materials, Inc. |
Lower liner with integrated flow equalizer and improved conductance |
8313578, |
Jan 28 2008 |
Applied Materials, Inc. |
Etching chamber having flow equalizer and lower liner |
20020069970, |
|
|
|
20050229849, |
|
|
|
20080041820, |
|
|
|
20080121620, |
|
|
|
D404370, |
Aug 20 1997 |
Tokyo Electron Limited |
Cap for use in a semiconductor wafer heat processing apparatus |
D404372, |
Aug 20 1997 |
Tokyo Electron Limited |
Ring for use in a semiconductor wafer heat processing apparatus |
D556704, |
Aug 25 2005 |
HITACHI HIGH-TECH CORPORATION |
Grounded electrode for a plasma processing apparatus |
D557226, |
Aug 25 2005 |
HITACHI HIGH-TECH CORPORATION |
Electrode cover for a plasma processing apparatus |
D593969, |
Oct 10 2006 |
Tokyo Electron Limited |
Processing chamber for manufacturing semiconductors |
D600221, |
Mar 28 2008 |
Tokyo Electron Limited |
Wafer boat |
D600222, |
Mar 28 2008 |
Tokyo Electron Limited |
Wafer boat |
D658691, |
Mar 30 2011 |
Tokyo Electron Limited |
Liner for plasma processing apparatus |
D658692, |
Mar 30 2011 |
Tokyo Electron Limited |
Liner for plasma processing apparatus |
D658693, |
Mar 30 2011 |
Tokyo Electron Limited |
Liner for plasma processing apparatus |
D678228, |
Mar 30 2011 |
Tokyo Electron Limited |
Chamber block |
D699692, |
Jan 19 2012 |
Applied Materials, Inc |
Upper liner |