Patent
   D716239
Priority
Nov 06 2013
Filed
Nov 06 2013
Issued
Oct 28 2014
Expiry
Oct 28 2028
Assg.orig
Entity
unknown
13
27
n/a
The ornamental design for an upper chamber liner, as shown and described.

FIG. 1 is a top perspective view of an upper chamber liner showing our new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a bottom perspective thereof;

FIG. 4 is another perspective view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a side view thereof;

FIG. 8 is another side view thereof;

FIG. 9 is another side view thereof;

FIG. 10 is a cross sectional view taken along line 10-10 in FIG. 5;

FIG. 11 is an enlarged portion view taken along lines 11-11 in FIG. 10; and,

FIG. 12 is an enlarged portion view taken along lines 12-12 in FIG. 10.

The broken lines in the figures form no part of the claimed design.

The upper chamber liner is shown broken away in FIGS. 11 and 12 to indicate that no particular length is claimed.

All surfaces not shown, form no part of the claimed design.

Samir, Mehmet Tugrul, Lau, Shu-Kwan

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Patent Priority Assignee Title
4340462, Feb 13 1981 LAM RESEARCH CORPORATION A CORP OF DELAWARE Adjustable electrode plasma processing chamber
6170429, Sep 30 1998 Lam Research Corporation Chamber liner for semiconductor process chambers
6277237, Sep 30 1998 Lam Research Corporation Chamber liner for semiconductor process chambers
6884297, Mar 31 2003 WONIK IPS CO , LTD Thin film deposition reactor
7011039, Jul 07 2000 Applied Materials, Inc Multi-purpose processing chamber with removable chamber liner
7234412, Apr 11 2002 Micron Technology, Inc. Semiconductor substrate deposition processor chamber liner apparatus
7942969, May 30 2007 Applied Materials, Inc. Substrate cleaning chamber and components
7987814, Apr 07 2008 Applied Materials, Inc.; Applied Materials, Inc Lower liner with integrated flow equalizer and improved conductance
8118938, Apr 07 2008 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
8282736, Apr 07 2008 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
8313578, Jan 28 2008 Applied Materials, Inc. Etching chamber having flow equalizer and lower liner
20020069970,
20050229849,
20080041820,
20080121620,
D404370, Aug 20 1997 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
D404372, Aug 20 1997 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
D556704, Aug 25 2005 HITACHI HIGH-TECH CORPORATION Grounded electrode for a plasma processing apparatus
D557226, Aug 25 2005 HITACHI HIGH-TECH CORPORATION Electrode cover for a plasma processing apparatus
D593969, Oct 10 2006 Tokyo Electron Limited Processing chamber for manufacturing semiconductors
D600221, Mar 28 2008 Tokyo Electron Limited Wafer boat
D600222, Mar 28 2008 Tokyo Electron Limited Wafer boat
D658691, Mar 30 2011 Tokyo Electron Limited Liner for plasma processing apparatus
D658692, Mar 30 2011 Tokyo Electron Limited Liner for plasma processing apparatus
D658693, Mar 30 2011 Tokyo Electron Limited Liner for plasma processing apparatus
D678228, Mar 30 2011 Tokyo Electron Limited Chamber block
D699692, Jan 19 2012 Applied Materials, Inc Upper liner
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 06 2013Applied Materials, Inc.(assignment on the face of the patent)
Nov 14 2013LAU, SHU-KWANApplied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0316800577 pdf
Nov 14 2013SAMIR, MEHMET TUGRULApplied Materials, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0316800577 pdf
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