PTO
Wrapper
PDF
|
Dossier
Espace
Google
|
|
Patent
D786201
|
Priority
Oct 19 2015
|
Filed
Oct 19 2015
|
Issued
May 09 2017
|
Expiry
May 09 2032
|
|
Assg.orig
|
|
Entity
unknown
|
2
|
14
|
n/a
|
|
|
I claim, the ornamental design for a heat sink for a woofer, as shown and described.
|
FIG. 1 is a perspective view of a heat sink for a woofer, showing my new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Bullimore, George
Patent |
Priority |
Assignee |
Title |
3205936, |
|
|
|
6601645, |
Apr 23 2002 |
|
Speaker heat sink |
D410438, |
Jan 31 1997 |
Tokyo Electron Limited |
Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
D427570, |
Jan 31 1997 |
Tokyo Electron Limited |
Quartz fin heat retaining tube |
D443262, |
Feb 19 1999 |
Magnadyne Corporation |
Speaker grill mounting plate |
D478556, |
Jan 10 2002 |
|
Speaker heat sink |
D556704, |
Aug 25 2005 |
HITACHI HIGH-TECH CORPORATION |
Grounded electrode for a plasma processing apparatus |
D585882, |
Feb 11 2008 |
Harman International Industries, Incorporated |
Loudspeaker housing |
D615937, |
Mar 06 2009 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
D703160, |
Jan 27 2011 |
HITACHI HIGH-TECH CORPORATION |
Grounded electrode for a plasma processing apparatus |
D716239, |
Nov 06 2013 |
Applied Materials, Inc |
Upper chamber liner |
D716240, |
Nov 07 2013 |
Applied Materials, Inc |
Lower chamber liner |
D717746, |
Nov 06 2013 |
Applied Materials, Inc |
Lower chamber liner |
D766849, |
May 15 2013 |
Ebara Corporation |
Substrate retaining ring |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a