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Patent
D478556
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Priority
Jan 10 2002
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Filed
Jan 10 2002
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Issued
Aug 19 2003
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Expiry
Aug 19 2017
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Assg.orig
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Entity
unknown
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3
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10
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n/a
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The ornamental design for a speaker heat sink, as shown.
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FIG. 1 is a perspective view of the ornamental design of the present invention;
FIG. 2 is a top view of the ornamental design shown in FIG. 1;
FIG. 3 is a bottom view of the ornamental design shown in FIG. 1;
FIG. 4 is a first elevation view of the ornamental design shown in FIG. 1; and,
FIG. 5 is a second elevation view of the ornamental design shown in FIG. 1.
Abdo, Nasser Abo
| Patent |
Priority |
Assignee |
Title |
| 3716098, |
|
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|
| 4396935, |
Oct 06 1980 |
NCR Corporation |
VLSI Packaging system |
| 5543663, |
Dec 27 1993 |
Kabushiki Kaisha Toshiba |
Semiconductor device and BGA package |
| 5789813, |
Sep 30 1996 |
Bell Semiconductor, LLC |
Ball grid array package with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom |
| 6125924, |
May 03 1999 |
|
Heat-dissipating device |
| 6304446, |
Aug 30 2000 |
|
Heat dissipater |
| 6330905, |
Sep 14 2000 |
Foxconn Precision Components Co., Ltd. |
Heat sink assembly |
| D404016, |
Jan 31 1997 |
Tokyo Electron Limited |
Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| D405428, |
Jan 31 1997 |
Tokyo Electron Limited |
Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| D410438, |
Jan 31 1997 |
Tokyo Electron Limited |
Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
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Maintenance Fee Events |
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