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I claim the ornamental design for heat retaining tube for use in a semiconductor wafer heat processing apparatus, as shown and described. |
FIG. 1 a perspective view of a heat retaining tube for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a top plan view thereof;
FIG. 3 a front elevational view thereof;
FIG. 4 a cross sectional view taken along line IV--IV in FIG. 3;
FIG. 5 a cross sectional view taken along line V--V in FIG. 3;
FIG. 6 a rear elevational view thereof;
FIG. 7 a left side view thereof, the right side view being a mirror image of the left view; and,
FIG. 8 a bottom plan view thereof.
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Jul 24 1997 | Tokyo Electron Limited | (assignment on the face of the patent) | / | |||
Nov 08 1997 | ISHII, KATSUTOSHI | Tokyo Electron Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008831 | /0352 |
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