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Patent
D798250
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Priority
Dec 01 2015
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Filed
May 27 2016
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Issued
Sep 26 2017
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Expiry
Sep 26 2032
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Assg.orig
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Entity
unknown
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14
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25
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n/a
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The ornamental design for a heater, as shown and described.
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FIG. 1 is a top plan view of a heater showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a back elevation view thereof;
FIG. 5 is a left side elevation view thereof; and,
FIG. 6 is a right side elevation view thereof.
The broken lines in the drawings illustrate subject matter that forms no part of the claimed design.
Furutani, Hiroshi, Sato, Yuusuke
Patent |
Priority |
Assignee |
Title |
D826185, |
Oct 14 2016 |
KOKUSAI ELECTRIC CORPORATION |
Ceiling heater for substrate processing apparatus |
D839221, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
D839222, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
D839223, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
D841605, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
D841606, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
D842260, |
May 30 2017 |
TINYPCB, INC |
Modular circuit board |
D846513, |
Apr 27 2016 |
NGK Insulators, Ltd. |
Sheet heater for electrostatic chuck |
D875057, |
May 26 2017 |
TINY PCB, Inc. |
Modular circuit board |
D887358, |
Dec 06 2018 |
Meta Platforms, Inc |
Motor membrane |
D918848, |
Jul 18 2019 |
KOKUSAI ELECTRIC CORPORATION |
Retainer of ceiling heater for semiconductor fabrication apparatus |
D959393, |
Sep 24 2020 |
KOKUSAI ELECTRIC CORPORATION |
Ceiling heater for substrate processing apparatus |
D962183, |
Jul 11 2019 |
KOKUSAI ELECTRIC CORPORATION |
Retainer plate of top heater for wafer processing furnace |
D962184, |
Jul 11 2019 |
KOKUSAI ELECTRIC CORPORATION |
Retainer plate of top heater for wafer processing furnace |
Patent |
Priority |
Assignee |
Title |
5540782, |
Oct 15 1992 |
Tokyo Electron Limited |
Heat treating apparatus having heat transmission-preventing plates |
5911896, |
Jun 25 1997 |
Brooks Automation, Inc |
Substrate heating apparatus with glass-ceramic panels and thin film ribbon heater element |
6037574, |
Nov 06 1997 |
Watlow Electric Manufacturing |
Quartz substrate heater |
6529686, |
Jun 06 2001 |
FSI International, Inc |
Heating member for combination heating and chilling apparatus, and methods |
6616767, |
Feb 12 1997 |
BAE SYSTEMS ADVANCED CERAMICS INC |
High temperature ceramic heater assembly with RF capability |
7645342, |
Nov 15 2004 |
Cree, Inc |
Restricted radiated heating assembly for high temperature processing |
8933375, |
Jun 27 2012 |
ASM IP Holding B.V. |
Susceptor heater and method of heating a substrate |
8986456, |
Oct 10 2006 |
ASM IP HOLDING B V |
Precursor delivery system |
20020190051, |
|
|
|
20050217583, |
|
|
|
D404016, |
Jan 31 1997 |
Tokyo Electron Limited |
Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
D404375, |
Aug 20 1997 |
Tokyo Electron Limited |
Heat retaining tube base for use in a semiconductor wafer head processing apparatus |
D405427, |
Jan 31 1997 |
Tokyo Electron Limited |
Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
D405428, |
Jan 31 1997 |
Tokyo Electron Limited |
Heat retaining tube for use in a semiconductor wafer heat processing apparatus |
D427570, |
Jan 31 1997 |
Tokyo Electron Limited |
Quartz fin heat retaining tube |
D428858, |
Jan 31 1997 |
Tokyo Electron Limited |
Quartz fin heat retaining tube |
D589471, |
Sep 28 2006 |
Tokyo Electron Limited |
Heater for manufacturing semiconductor |
D600220, |
Mar 28 2008 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
D600660, |
Mar 28 2008 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
D601521, |
Sep 28 2006 |
Tokyo Electron Limited |
Heater for manufacturing semiconductor |
D604257, |
Oct 27 2005 |
COORSTEK KK |
Heater for semiconductor manufacturing |
D614153, |
Oct 10 2007 |
ASM IP HOLDING B V |
Reactant source vessel |
D615937, |
Mar 06 2009 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
D616392, |
Mar 06 2009 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
D616393, |
Mar 06 2009 |
Tokyo Electron Limited |
Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a