Heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers

Abstract

Description

FIG. 1 is a perspective view;

FIG. 2 is a front view;

FIG. 3 is a rear view;

FIG. 4 is a right side view the left side being a mirror image thereof;

FIG. 5 is a plan view the bottom view being a mirror image thereof; and;

FIG. 6 is a sectional view along 6—6 of a front view of FIG. 2.

Claims

The ornamental design for a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.