Fin for use in a semiconductor wafer heat processing apparatus

Abstract

Description

FIG. 1 a perspective view of a fin for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a front elevational view thereof;

FIG. 3 a right side view thereof;

FIG. 4 a top plan view thereof;

FIG. 5 a bottom plan view therof;

FIG. 6 a cross-sectional view taken along line VI-VI in FIG. 2; and,

FIG. 7 a cross-sectional view taken alone line VII-VII in FIG. 4.

Claims

I claim the ornamental design for a fin for use in a semiconductor wafer heat processing apparatus, as shown and described.