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Patent
D600220
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Priority
Mar 28 2008
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Filed
Sep 26 2008
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Issued
Sep 15 2009
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Expiry
Sep 15 2023
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Assg.orig
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Entity
unknown
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8
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11
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n/a
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The ornamental design for a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.
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FIG. 1 is a perspective view;
FIG. 2 is a front view;
FIG. 3 is a rear view;
FIG. 4 is a right side view the left side being a mirror image thereof;
FIG. 5 is a plan view;
FIG. 6 is a bottom view; and,
FIG. 7 is a sectional view thereof along line 7—7 of FIG. 2.
Sato, Izumi
Patent |
Priority |
Assignee |
Title |
5567986, |
Jun 04 1993 |
Diamond Electric Mfg. Co., Ltd. |
Heat sink |
5718574, |
Mar 01 1995 |
ESC MEDICAL SYSTEMS, INC |
Heat treatment apparatus |
6099302, |
Jun 23 1998 |
Samsung Electronics Co., Ltd. |
Semiconductor wafer boat with reduced wafer contact area |
6575231, |
Aug 27 2002 |
|
Spiral step-shaped heat dissipating module |
6716027, |
Jan 18 2001 |
Samsung Electronics Co., Ltd. |
Semiconductor wafer boat having stackable independently replaceable boat parts and vertical heat-treating apparatus comprising the same |
7163393, |
Feb 02 2004 |
Sumitomo Mitsubishi Silicon Corporation |
Heat treatment jig for semiconductor silicon substrate |
7204887, |
Oct 16 2000 |
Nippon Steel Corporation |
Wafer holding, wafer support member, wafer boat and heat treatment furnace |
20030000472, |
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|
20040069453, |
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D404373, |
Aug 20 1997 |
Tokyo Electron Limited |
Fin for use in a semiconductor wafer heat processing apparatus |
D404374, |
Aug 20 1997 |
Tokyo Electron Limited |
Fin for use in a semiconductor wafer heat processing apparatus |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a