The ornamental design for a heatradiationfin of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.
FIG. 1 is front perspective view of a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers illustrating my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof; and,
FIG. 8 is a front perspective view of a heat radiation fin of heat insulating cylinder for manufacturing semiconductor wafers in use.
The broken lines are shown for illustrative purposes only and form no part of the claimed design.