Patent
   D405428
Priority
Jan 31 1997
Filed
Jul 24 1997
Issued
Feb 09 1999
Expiry
Feb 09 2013
Assg.orig
Entity
unknown
7
8
n/a
I claim the ornamental design for a heat retaining tube for use in a semiconductor wafer heat processing apparatus, as shown and described.

FIG. 1: a perspective view of a heat retaining tube for use in a semiconductor wafer heat processing apparatus;

FIG. 2: a top plan view thereof;

FIG. 3: a front elevational view thereof;

FIG. 4: a cross sectional view thereof taken along line IV--IV in FIG. 3;

FIG. 5: a cross sectional view thereof taken along line V--V in FIG. 3;

FIG. 6: a left side view thereof;

FIG. 7: a right side view thereof;

FIG. 8: a bottom plan view thereof; and,

FIG. 9: a rear elevational view thereof.

Ishii, Katsutoshi

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D798250, Dec 01 2015 NuFlare Technology, Inc. Heater
Patent Priority Assignee Title
4857689, Mar 23 1988 Axcelis Technologies, Inc Rapid thermal furnace for semiconductor processing
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5407449, Mar 10 1992 ASM INTERNATIONAL N V Device for treating micro-circuit wafers
5516732, Dec 04 1992 Tokyo Electron Limited Wafer processing machine vacuum front end method and apparatus
5658115, Sep 05 1991 Hitachi, Ltd. Transfer apparatus
5752796, Jan 24 1996 Brooks Automation, Inc Vacuum integrated SMIF system
D361752, Sep 17 1993 Tokyo Electron Kabushiki Kaisha; Tokyo Electron Tohoku Kabushiki Kaisha Wafer boat or rack for holding semiconductor wafers
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 24 1997Tokyo Electron Ltd.(assignment on the face of the patent)
Nov 08 1997ISHII, KATSUTOSHITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0088310361 pdf
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