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I claim the ornamental design for a heat retaining tube for use in a semiconductor wafer heat processing apparatus, as shown and described. |
FIG. 1: a perspective view of a heat retaining tube for use in a semiconductor wafer heat processing apparatus;
FIG. 2: a top plan view thereof;
FIG. 3: a front elevational view thereof;
FIG. 4: a cross sectional view thereof taken along line IV--IV in FIG. 3;
FIG. 5: a cross sectional view thereof taken along line V--V in FIG. 3;
FIG. 6: a left side view thereof;
FIG. 7: a right side view thereof;
FIG. 8: a bottom plan view thereof; and,
FIG. 9: a rear elevational view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 24 1997 | Tokyo Electron Ltd. | (assignment on the face of the patent) | / | |||
Nov 08 1997 | ISHII, KATSUTOSHI | Tokyo Electron Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008831 | /0361 |
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