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I claim the ornamental design for a heat retaining tube base for use in a semiconductor wafer heat processing apparatus, as shown and described. |
FIG. 1 a perspective view of a heat retaining tube base for use in a semiconductor wafer heat processing apparatus;
FIG. 2 a front elevational view thereof;
FIG. 3 a top plan view thereof;
FIG. 4 a right side view thereof;
FIG. 5 a bottom plan view thereof; and,
FIG. 6 a cross-sectional view taken along line VI--VI in Fig. 3.
Patent | Priority | Assignee | Title |
D574792, | Aug 23 2006 | Tokyo Electron Limited | Lower heat insulating cylinder for manufacturing semiconductor wafers |
D579885, | Feb 20 2007 | Tokyo Electron Limited | Upper heat insulating cylinder for manufacturing semiconductor wafers |
D601979, | Mar 28 2008 | Tokyo Electron Limited | Pedestal base of a heat insulating cylinder for manufacturing semiconductor wafers |
D616394, | Mar 06 2009 | Tokyo Electron Limited | Support of wafer boat for manufacturing semiconductor wafers |
D616395, | Mar 11 2009 | Tokyo Electron Limited | Support of wafer boat for manufacturing semiconductor wafers |
D798250, | Dec 01 2015 | NuFlare Technology, Inc. | Heater |
Patent | Priority | Assignee | Title |
4857689, | Mar 23 1988 | Axcelis Technologies, Inc | Rapid thermal furnace for semiconductor processing |
5314574, | Jun 26 1992 | Tokyo Electron Kabushiki Kaisha | Surface treatment method and apparatus |
5320218, | Apr 07 1992 | MURATEC AUTOMATION CO , LTD | Closed container to be used in a clean room |
5752796, | Jan 24 1996 | Brooks Automation, Inc | Vacuum integrated SMIF system |
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Feb 12 1998 | Tokyo Electron Limited | (assignment on the face of the patent) | / | |||
Mar 18 1998 | SHIMAZU, TOMOHISA | Tokyo Electron Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009126 | /0765 |
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