Patent
   D404375
Priority
Aug 20 1997
Filed
Feb 12 1998
Issued
Jan 19 1999
Expiry
Jan 19 2013
Assg.orig
Entity
unknown
6
4
n/a
I claim the ornamental design for a heat retaining tube base for use in a semiconductor wafer heat processing apparatus, as shown and described.

FIG. 1 a perspective view of a heat retaining tube base for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a front elevational view thereof;

FIG. 3 a top plan view thereof;

FIG. 4 a right side view thereof;

FIG. 5 a bottom plan view thereof; and,

FIG. 6 a cross-sectional view taken along line VI--VI in Fig. 3.

Shimazu, Tomohisa

Patent Priority Assignee Title
D574792, Aug 23 2006 Tokyo Electron Limited Lower heat insulating cylinder for manufacturing semiconductor wafers
D579885, Feb 20 2007 Tokyo Electron Limited Upper heat insulating cylinder for manufacturing semiconductor wafers
D601979, Mar 28 2008 Tokyo Electron Limited Pedestal base of a heat insulating cylinder for manufacturing semiconductor wafers
D616394, Mar 06 2009 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
D616395, Mar 11 2009 Tokyo Electron Limited Support of wafer boat for manufacturing semiconductor wafers
D798250, Dec 01 2015 NuFlare Technology, Inc. Heater
Patent Priority Assignee Title
4857689, Mar 23 1988 Axcelis Technologies, Inc Rapid thermal furnace for semiconductor processing
5314574, Jun 26 1992 Tokyo Electron Kabushiki Kaisha Surface treatment method and apparatus
5320218, Apr 07 1992 MURATEC AUTOMATION CO , LTD Closed container to be used in a clean room
5752796, Jan 24 1996 Brooks Automation, Inc Vacuum integrated SMIF system
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 12 1998Tokyo Electron Limited(assignment on the face of the patent)
Mar 18 1998SHIMAZU, TOMOHISATokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0091260765 pdf
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