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Patent
D604257
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Priority
Oct 27 2005
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Filed
Apr 27 2006
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Issued
Nov 17 2009
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Expiry
Nov 17 2023
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Assg.orig
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Entity
unknown
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1
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7
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n/a
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The ornamental design for a heater for semiconductor manufacturing, as shown and described.
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FIG. 1 is an enlarged front elevation view of a heater for semiconductor manufacturing showing our new design;
FIG. 2 is an enlarged left side elevation view, the right side being a mirror image thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is an enlarged top plan view of the area 5—5 shown in FIG. 3; and,
FIG. 6 is an enlarged bottom plan view of the area 6—6 shown in FIG. 4.
The broken lines shown in the figures are for illustrative purposes only and form no part of the claimed design.
Honma, Hiroyuki, Yamaga, Kenichi, Inatomi, Yasuhiro
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Apr 20 2006 | INATOMI, YASUHIRO | Tokyo Electron Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 018025 | /0001 |
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Apr 20 2006 | INATOMI, YASUHIRO | TOSHIBA CERAMICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 018025 | /0001 |
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Apr 24 2006 | YAMAGA, KENICHI | Tokyo Electron Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 018025 | /0001 |
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Apr 24 2006 | YAMAGA, KENICHI | TOSHIBA CERAMICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 018025 | /0001 |
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Apr 27 2006 | | Tokyo Electron Limited | (assignment on the face of the patent) | | / |
Apr 27 2006 | | Toshiba Ceramics Co., Ltd. | (assignment on the face of the patent) | | / |
May 15 2006 | HONMA, HIROYUKI | Tokyo Electron Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 018025 | /0001 |
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May 15 2006 | HONMA, HIROYUKI | TOSHIBA CERAMICS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 018025 | /0001 |
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Oct 01 2015 | Covalent Materials Corporation | COORSTEK KK | CHANGE OF NAME & ADDRESS | 038400 | /0465 |
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