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I claim the ornamental design for a heat retaining tube for use in a semiconductor wafer heat processing apparatus, as shown and described. |
FIG. 1: a perspective view of a heat retaining tube for use in a semiconductor wafer heat processing apparatus;
FIG. 2: a top plan view thereof;
FIG. 3: a front elevational view thereof, the rear elevational view is identical with the front view;
FIG. 4: a right side view thereof, the left side view being a mirror image of the right view;
FIG. 5: a bottom plan view thereof; and,
FIG. 6: a cross sectional view thereof taken along line VI--VI in FIG. 3.
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Jul 24 1997 | Tokyo Electron Limited | (assignment on the face of the patent) | / | |||
Nov 08 1997 | ISHII, KATSUTOSHI | Tokyo Electron Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008854 | /0262 |
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