Patent
   D405427
Priority
Jan 31 1997
Filed
Jul 24 1997
Issued
Feb 09 1999
Expiry
Feb 09 2013
Assg.orig
Entity
unknown
6
8
n/a
I claim the ornamental design for a heat retaining tube for use in a semiconductor wafer heat processing apparatus, as shown and described.

FIG. 1: a perspective view of a heat retaining tube for use in a semiconductor wafer heat processing apparatus;

FIG. 2: a top plan view thereof;

FIG. 3: a front elevational view thereof, the rear elevational view is identical with the front view;

FIG. 4: a right side view thereof, the left side view being a mirror image of the right view;

FIG. 5: a bottom plan view thereof; and,

FIG. 6: a cross sectional view thereof taken along line VI--VI in FIG. 3.

Ishii, Katsutoshi

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Patent Priority Assignee Title
4857689, Mar 23 1988 Axcelis Technologies, Inc Rapid thermal furnace for semiconductor processing
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5658115, Sep 05 1991 Hitachi, Ltd. Transfer apparatus
5752796, Jan 24 1996 Brooks Automation, Inc Vacuum integrated SMIF system
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 24 1997Tokyo Electron Limited(assignment on the face of the patent)
Nov 08 1997ISHII, KATSUTOSHITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0088540262 pdf
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