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I claim the ornamental design for a heat retaining tube for use in a semiconductor wafer heat processing apparatus, as shown and described. |
FIG. 1 a perspective view of a heat retaining tube for use in a semiconductor wafer heat processing apparatus.
FIG. 2 a front elevational view thereof, the rear elevational view being a mirror image of the front view.
FIG. 3 a top plan view thereof.
FIG. 4 a bottom plan view thereof.
FIG. 5 a right side view thereof.
FIG. 6 a left side view thereof.
FIG. 7 a cross sectional view thereof taken along lineVII--VIl in FIG. 3; and,
FIG. 8 a cross sectional view thereof taken along line VIII--VIII in FIG. 2 .
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Nov 08 1997 | ISHII, KATSUTOSHI | Tokyo Electron Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008831 | /0333 |
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