Patent
   D913229
Priority
Apr 24 2019
Filed
Oct 15 2019
Issued
Mar 16 2021
Expiry
Mar 16 2036
Assg.orig
Entity
unknown
0
9
n/a
The ornamental design for a heater for heating semiconductor wafer, as shown and described.

FIG. 1 is a perspective view of a heater for heating semiconductor wafer, showing my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

Kobayashi, Toshiki

Patent Priority Assignee Title
Patent Priority Assignee Title
6080970, Dec 26 1997 Kyocera Corporation Wafer heating apparatus
8610034, Aug 26 2008 NuFlare Technology, Inc. Heater, manufacturing apparatus for semiconductor device, and manufacturing method for semiconductor device
20060096972,
D402156, Feb 02 1996 AKO-Werke GmbH & Co. KG Radiant stove heating element
D410438, Jan 31 1997 Tokyo Electron Limited Heat retaining tube for use in a semiconductor wafer heat processing apparatus
D423028, Aug 26 1998 Matsushita Electric Industrial Co., Ltd. Coil
D706714, Mar 12 2010 Fluke Corporation Rogowski coil
D797690, Mar 16 2015 NUFLARE TECHNOLOGY, INC Heater for semiconductor manufacturing apparatus
D839224, Dec 12 2016 Ebara Corporation Elastic membrane for semiconductor wafer polishing
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Sep 27 2019KOBAYASHI, TOSHIKITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0507390912 pdf
Oct 15 2019Tokyo Electron Limited(assignment on the face of the patent)
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