Patent
   D797690
Priority
Mar 16 2015
Filed
Sep 15 2015
Issued
Sep 19 2017
Expiry
Sep 19 2032
Assg.orig
Entity
unknown
18
23
n/a
The ornamental design for a heater for semiconductor manufacturing apparatus, as illustrated and described.

FIG. 1 is a top plan view of a heater for semiconductor manufacturing apparatus according to our new design;

FIG. 2 is a bottom plan view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a back view thereof;

FIG. 5 is a left side view thereof; and,

FIG. 6 is a right side view thereof.

Furutani, Hiroshi, Sato, Yuusuke

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ER6103,
Patent Priority Assignee Title
1258760,
5043559, Nov 04 1989 Ceramaspeed Limited Radiant electric heaters
6037574, Nov 06 1997 Watlow Electric Manufacturing Quartz substrate heater
6080970, Dec 26 1997 Kyocera Corporation Wafer heating apparatus
6207935, Sep 21 1996 Diehl AKO Stiftung & Co. KG Radiant heating element with a metal foil heat conductor
6753507, Apr 27 2001 Kyocera Corporation Wafer heating apparatus
6806443, Apr 24 2002 Sumitomo Electric Industries, Ltd. Ceramic susceptor
7777160, Dec 17 2007 Momentive Performance Materials Inc. Electrode tuning method and apparatus for a layered heater structure
8610034, Aug 26 2008 NuFlare Technology, Inc. Heater, manufacturing apparatus for semiconductor device, and manufacturing method for semiconductor device
20020088111,
20020190051,
20030121898,
20060130763,
20070221657,
20110039399,
20130068164,
20160270150,
176456,
D313072, Feb 10 1988 GDA Applied Energy Limited Electric heater element for use in a radiant heater for a glass ceramic hob
D589471, Sep 28 2006 Tokyo Electron Limited Heater for manufacturing semiconductor
D616389, Oct 20 2008 Ebara Corporation Vacuum contact pad
71205,
D716774, Apr 04 2014 Avery Dennison Retail Information Services LLC RFID inlay
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 15 2015NuFlare Technology, Inc.(assignment on the face of the patent)
Nov 18 2015FURUTANI, HIROSHINUFLARE TECHNOLOGY, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0371660447 pdf
Nov 20 2015SATO, YUUSUKENUFLARE TECHNOLOGY, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0371660447 pdf
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