Patent
   D616389
Priority
Oct 20 2008
Filed
Apr 17 2009
Issued
May 25 2010
Expiry
May 25 2024
Assg.orig
Entity
unknown
33
13
n/a
The ornamental design for a vacuum contact pad, as shown and described.

FIG. 1 is a front elevation view of a vacuum contact pad showing our new design, the rear view being a mirror image thereof;

FIG. 2 is a right side elevation view, the left side being a mirror image thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a perspective view thereof;

FIG. 6 is a partial enlarged perspective view thereof; and,

FIG. 7 is a perspective view showing the usable state thereof.

The broken line showing of the environment is for illustrative purposes only and forms no part of the claimed design.

Takahashi, Tamami

Patent Priority Assignee Title
10208884, Jan 30 2014 DRAINGARDE, INC Watershed protection device and system
11842917, May 20 2019 Applied Materials, Inc. Process kit ring adaptor
D650344, Oct 20 2008 Ebara Corporation Vacuum contact pad
D654033, Jan 20 2010 CELADON SYSTEMS, INC Grooved wire support for a probe test core
D713363, Dec 31 2013 CELADON SYSTEMS, INC Support for a probe test core
D722031, Dec 31 2013 CELADON SYSTEMS, INC Top contact layout board in an electrical system
D770404, Aug 05 2015 WiTricity Corporation Resonator coil
D790489, Jul 08 2015 Ebara Corporation Vacuum contact pad
D792962, Nov 28 2014 DRAINGARDE INC. Catch basin cover
D797690, Mar 16 2015 NUFLARE TECHNOLOGY, INC Heater for semiconductor manufacturing apparatus
D859331, Mar 31 2017 Ebara Corporation Vacuum contact pad
D873782, May 17 2016 Electro Scientific Industries, Inc Component carrier plate
D894137, Oct 05 2017 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
D902165, Mar 09 2018 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
D908645, Aug 26 2019 Applied Materials, Inc Sputtering target for a physical vapor deposition chamber
D921431, Apr 01 2019 VEECO INSTRUMENTS, INC Multi-filament heater assembly
D933725, Feb 08 2019 Applied Materials, Inc Deposition ring for a substrate processing chamber
D937329, Mar 23 2020 Applied Materials, Inc Sputter target for a physical vapor deposition chamber
D940765, Dec 02 2020 Applied Materials, Inc Target profile for a physical vapor deposition chamber target
D941371, Mar 20 2020 Applied Materials, Inc Process shield for a substrate processing chamber
D941372, Mar 20 2020 Applied Materials, Inc Process shield for a substrate processing chamber
D942516, Feb 08 2019 Applied Materials, Inc Process shield for a substrate processing chamber
D946638, Dec 11 2017 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
D947802, May 20 2020 Applied Materials, Inc Replaceable substrate carrier interfacing film
D959393, Sep 24 2020 KOKUSAI ELECTRIC CORPORATION Ceiling heater for substrate processing apparatus
D966357, Dec 02 2020 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
D970566, Mar 23 2020 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
D980176, Jun 02 2020 Applied Materials, Inc Substrate processing system carrier
D980177, Sep 24 2020 KOKUSAI ELECTRIC CORPORATION Ceiling heater for substrate processing apparatus
ER4518,
ER6877,
ER6966,
ER8863,
Patent Priority Assignee Title
3627338,
5042421, Jul 25 1989 Manhattan R&D, Inc. Rotatable vacuum chuck with magnetic means
5374829, May 07 1990 Canon Kabushiki Kaisha Vacuum chuck
6091079, Mar 27 1992 Micron Technology, Inc. Semiconductor wafer
6196532, Aug 27 1999 Applied Materials, Inc 3 point vacuum chuck with non-resilient support members
6257564, May 15 1998 Applied Materials, Inc Vacuum chuck having vacuum-nipples wafer support
7115984, Jun 18 2002 U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices
20050035514,
20070063453,
20090179365,
D552565, Sep 08 2005 TOKYO OHKA KOGYO CO , LTD Supporting plate
JP2007250601,
WO2006112531,
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 13 2009TAKAHASHI, TAMAMIEbara CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0225610551 pdf
Apr 17 2009Ebara Corporation(assignment on the face of the patent)
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule