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Patent
D716240
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Priority
Nov 07 2013
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Filed
Nov 07 2013
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Issued
Oct 28 2014
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Expiry
Oct 28 2028
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Assg.orig
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Entity
unknown
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14
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27
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n/a
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The ornamental design for a lower chamber liner, as shown and described.
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FIG. 1 is a top perspective view of a lower chamber liner showing our new design;
FIG. 2 is another top perspective view thereof;
FIG. 3 is a bottom perspective view thereof;
FIG. 4 is another bottom perspective view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a side view thereof;
FIG. 8 is another side view thereof;
FIG. 9 is another side view thereof;
FIG. 10 is a cross sectional view taken along line 10-10 in FIG. 5;
FIG. 11 is an enlarged portion view taken along lines 11-11 in FIG. 10; and,
FIG. 12 is an enlarged portion view taken along lines 12-12 in FIG. 10.
The broken lines in the figures form no part of the claimed design.
The upper chamber liner is shown broken away in FIGS. 11 and 12 to indicate that no particular length is claimed.
All surfaces not shown, form no part of the claimed design.
Chang, Anzhong, Brillhart, Paul, Samir, Mehmet Tugrul, Lau, Shu-Kwan, Collins, Richard O.
Patent |
Priority |
Assignee |
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D804436, |
Jun 12 2015 |
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D812578, |
Feb 26 2016 |
HITACHI HIGH-TECH CORPORATION |
Upper chamber for a plasma processing apparatus |
D837754, |
Apr 28 2017 |
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Plasma chamber liner |
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Apr 28 2017 |
Applied Materials, Inc |
Plasma chamber liner |
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Apr 28 2017 |
Applied Materials, Inc |
Plasma chamber liner |
D875053, |
Apr 28 2017 |
Applied Materials, Inc |
Plasma connector liner |
D875054, |
Apr 28 2017 |
Applied Materials, Inc |
Plasma connector liner |
D875055, |
Apr 28 2017 |
Applied Materials, Inc |
Plasma connector liner |
D925481, |
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KOKUSAI ELECTRIC CORPORATION |
Inlet liner for substrate processing apparatus |
ER5584, |
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Patent |
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Title |
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Feb 13 1981 |
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Sep 30 1998 |
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Apr 07 2008 |
Applied Materials, Inc. |
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Aug 20 1997 |
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Aug 20 1997 |
Tokyo Electron Limited |
Ring for use in a semiconductor wafer heat processing apparatus |
D556704, |
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Grounded electrode for a plasma processing apparatus |
D557226, |
Aug 25 2005 |
HITACHI HIGH-TECH CORPORATION |
Electrode cover for a plasma processing apparatus |
D593969, |
Oct 10 2006 |
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Mar 30 2011 |
Tokyo Electron Limited |
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Tokyo Electron Limited |
Liner for plasma processing apparatus |
D658693, |
Mar 30 2011 |
Tokyo Electron Limited |
Liner for plasma processing apparatus |
D678228, |
Mar 30 2011 |
Tokyo Electron Limited |
Chamber block |
D699692, |
Jan 19 2012 |
Applied Materials, Inc |
Upper liner |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 07 2013 | | Applied Materials, Inc. | (assignment on the face of the patent) | | / |
Nov 13 2013 | BRILLHART, PAUL | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031681 | /0491 |
pdf |
Nov 14 2013 | LAU, SHU-KWAN | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031681 | /0491 |
pdf |
Nov 14 2013 | SAMIR, MEHMET TUGRUL | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031681 | /0491 |
pdf |
Nov 14 2013 | CHANG, ANZHONG | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031681 | /0491 |
pdf |
Nov 18 2013 | COLLINS, RICHARD O | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031681 | /0491 |
pdf |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a