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The ornamental design for a cover ring for a plasma processing apparatus, as shown and described.
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This application contains subject matter related to the following co-pending U.S. design patent applications:
Application Ser. No. 29/610,995, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”;
Application Ser. No. 29/610,996, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”;
Application Ser. No. 29/610,998, filed herewith and entitled “Ring for a Plasma Processing Apparatus”; and
Application Ser. No. 29/611,001, filed herewith and entitled “Discharge Chamber for a Plasma Processing Apparatus”.
The box labelled as 10 in
Nakamoto, Kazunori, Sato, Kohei, Ichino, Takamasa
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 18 2017 | Hitachi High-Technologies Corporation | (assignment on the face of the patent) | / | |||
Aug 28 2017 | ICHINO, TAKAMASA | Hitachi High-Technologies Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 043599 | /0924 | |
Aug 28 2017 | SATO, KOHEI | Hitachi High-Technologies Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 043599 | /0924 | |
Aug 28 2017 | NAKAMOTO, KAZUNORI | Hitachi High-Technologies Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 043599 | /0924 | |
Feb 12 2020 | Hitachi High-Technologies Corporation | HITACHI HIGH-TECH CORPORATION | CHANGE OF NAME AND ADDRESS | 052259 | /0227 |
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