Patent
   D494551
Priority
Dec 12 2002
Filed
Jun 12 2003
Issued
Aug 17 2004
Expiry
Aug 17 2018
Assg.orig
Entity
unknown
19
9
n/a
I claim the ornamental design for exhaust ring for manufacturing semiconductors, as shown and described.

FIG. 1 is a front/top perspective view of an exhaust ring for manufacturing semiconductors showing my new design;

FIG. 2 is a top plan view thereof, the bottom plan view being a mirror image and, therefore, not shown;

FIG. 3 is a front elevational view thereof, the left-side elevational view being a mirror image and, therefore, not shown;

FIG. 4 is a right-side elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a reference front elevational view thereof;

FIG. 7 is a right-side cross-sectional view taken along line 7--7 in FIG. 6; and,

FIG. 8 is an enlarged, partial, cross-sectional view taken along line 8--8 in FIG. 7.

The exhaust ring for manufacturing semiconductors is used in a vacuum vessel for manufacturing semiconductors.

Doba, Shigeki

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Patent Priority Assignee Title
5310453, Feb 13 1992 Tokyo Electron Limited Plasma process method using an electrostatic chuck
6068441, Nov 21 1997 ASM America, Inc Substrate transfer system for semiconductor processing equipment
6155915, Mar 24 1999 Advanced Micro Devices, Inc. System and method for independent air bearing zoning for semiconductor polishing device
20030017714,
20030124820,
20040025788,
20040056017,
D404370, Aug 20 1997 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
D404372, Aug 20 1997 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 12 2003Tokyo Electron Limited(assignment on the face of the patent)
Jun 25 2003DOBA, SHIGEKITokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0143770817 pdf
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