|
I claim the ornamental design for exhaust ring for manufacturing semiconductors, as shown and described.
|
|||||||||||||||||
FIG. 1 is a front/top perspective view of an exhaust ring for manufacturing semiconductors showing my new design;
FIG. 2 is a top plan view thereof, the bottom plan view being a mirror image and, therefore, not shown;
FIG. 3 is a front elevational view thereof, the left-side elevational view being a mirror image and, therefore, not shown;
FIG. 4 is a right-side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a reference front elevational view thereof;
FIG. 7 is a right-side cross-sectional view taken along line 7--7 in FIG. 6; and,
FIG. 8 is an enlarged, partial, cross-sectional view taken along line 8--8 in FIG. 7.
The exhaust ring for manufacturing semiconductors is used in a vacuum vessel for manufacturing semiconductors.
| Patent | Priority | Assignee | Title |
| D556704, | Aug 25 2005 | HITACHI HIGH-TECH CORPORATION | Grounded electrode for a plasma processing apparatus |
| D557226, | Aug 25 2005 | HITACHI HIGH-TECH CORPORATION | Electrode cover for a plasma processing apparatus |
| D694790, | Sep 20 2011 | Tokyo Electron Limited | Baffle plate for manufacturing semiconductor |
| D696638, | Feb 18 2013 | SPS INC | Magnetic connector electrode terminal module |
| D697038, | Sep 20 2011 | Tokyo Electron Limited | Baffle plate |
| D770992, | Jun 12 2015 | HITACHI HIGH-TECH CORPORATION | Electrode cover for a plasma processing apparatus |
| D797691, | Apr 14 2016 | Applied Materials, Inc | Composite edge ring |
| D827592, | Jan 31 2017 | HITACHI HIGH-TECH CORPORATION | Electrode cover for a plasma processing apparatus |
| D836573, | Jan 31 2017 | HITACHI HIGH-TECH CORPORATION | Ring for a plasma processing apparatus |
| D840364, | Jan 31 2017 | HITACHI HIGH-TECH CORPORATION | Electrode cover for a plasma processing apparatus |
| D840365, | Jan 31 2017 | HITACHI HIGH-TECH CORPORATION | Cover ring for a plasma processing apparatus |
| D871609, | Aug 31 2017 | HITACHI HIGH-TECH CORPORATION | Electrode plate peripheral ring for a plasma processing apparatus |
| D873782, | May 17 2016 | Electro Scientific Industries, Inc | Component carrier plate |
| D907593, | Jan 20 2017 | HITACHI HIGH-TECH CORPORATION | Discharge chamber for a plasma processing apparatus |
| D916038, | Mar 19 2019 | HITACHI HIGH-TECH CORPORATION | Grounded electrode for a plasma processing apparatus |
| D943539, | Mar 19 2020 | Applied Materials, Inc | Confinement plate for a substrate processing chamber |
| D971167, | Aug 28 2019 | Applied Materials, Inc. | Lower shield for a substrate processing chamber |
| D979524, | Mar 19 2020 | Applied Materials, Inc | Confinement liner for a substrate processing chamber |
| D986190, | Mar 19 2020 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
| ER1664, | |||
| ER6962, |
| Patent | Priority | Assignee | Title |
| 5310453, | Feb 13 1992 | Tokyo Electron Limited | Plasma process method using an electrostatic chuck |
| 6068441, | Nov 21 1997 | ASM America, Inc | Substrate transfer system for semiconductor processing equipment |
| 6155915, | Mar 24 1999 | Advanced Micro Devices, Inc. | System and method for independent air bearing zoning for semiconductor polishing device |
| 20030017714, | |||
| 20030124820, | |||
| 20040025788, | |||
| 20040056017, | |||
| D404370, | Aug 20 1997 | Tokyo Electron Limited | Cap for use in a semiconductor wafer heat processing apparatus |
| D404372, | Aug 20 1997 | Tokyo Electron Limited | Ring for use in a semiconductor wafer heat processing apparatus |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jun 12 2003 | Tokyo Electron Limited | (assignment on the face of the patent) | / | |||
| Jun 25 2003 | DOBA, SHIGEKI | Tokyo Electron Limited | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014377 | /0817 |
| Date | Maintenance Fee Events |
| Date | Maintenance Schedule |