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The ornamental design for a discharge chamber for a plasma processing apparatus, as shown and described.
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This application contains subject matter related to the following co-pending U.S. design patent applications:
Application No. 29/610,995, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”;
Application No. 29/610,996, filed herewith and entitled “Electrode Cover for a Plasma Processing Apparatus”;
Application No. 29/610,998, filed herewith and entitled “Ring for a Plasma Processing Apparatus”; and
Application No. 29/610,999, filed herewith and entitled “Cover Ring for a Plasma Processing Apparatus”.
Nunomura, Nobuhide, Ogawa, Keitarou
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Jul 18 2017 | HITACHI HIGH-TECH CORPORATION | (assignment on the face of the patent) | / | |||
Aug 25 2017 | NUNOMURA, NOBUHIDE | Hitachi High-Technologies Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 043599 | /0942 | |
Aug 25 2017 | OGAWA, KEITAROU | Hitachi High-Technologies Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 043599 | /0942 | |
Feb 12 2020 | Hitachi High-Technologies Corporation | HITACHI HIGH-TECH CORPORATION | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 052398 | /0249 |
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