FIG. 1 is a front, top and right side enlarged perspective view of an electrode cover for a plasma processing apparatus showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 6; and,
FIG. 9 is an enlarged portion view taken along line 9-9 of FIG. 8.
Patent |
Priority |
Assignee |
Title |
11581166, |
Jul 31 2020 |
Applied Materials, Inc |
Low profile deposition ring for enhanced life |
D793572, |
Jun 10 2015 |
Tokyo Electron Limited |
Electrode plate for plasma processing apparatus |
D795208, |
Aug 18 2015 |
Tokyo Electron Limited |
Electrostatic chuck for semiconductor manufacturing equipment |
D797067, |
Apr 21 2015 |
Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D798248, |
Jun 18 2015 |
Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D799437, |
Aug 25 2015 |
Ebara Corporation |
Substrate retaining ring |
D801942, |
Apr 16 2015 |
Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D802472, |
Aug 06 2015 |
Pall Corporation |
Electrostatic chuck for semiconductor manufacturing equipment |
D802545, |
Jun 12 2015 |
HITACHI HIGH-TECH CORPORATION |
Lower chamber for a plasma processing apparatus |
D802790, |
Jun 12 2015 |
HITACHI HIGH-TECH CORPORATION |
Cover ring for a plasma processing apparatus |
D803802, |
Aug 18 2015 |
Tokyo Electron Limited |
Electrostatic chuck for semiconductor manufacturing equipment |
D803917, |
Jun 16 2015 |
KOKUSAI ELECTRIC CORPORATION |
Heat reflector for substrate processing apparatus |
D804556, |
Jun 16 2015 |
KOKUSAI ELECTRIC CORPORATION |
Heat reflector for substrate processing apparatus |
D810705, |
Apr 01 2016 |
VEECO INSTRUMENTS, INC |
Self-centering wafer carrier for chemical vapor deposition |
D825504, |
Apr 21 2015 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D825505, |
Jun 18 2015 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D827592, |
Jan 31 2017 |
HITACHI HIGH-TECH CORPORATION |
Electrode cover for a plasma processing apparatus |
D828419, |
Feb 23 2016 |
Joy Global Underground Mining LLC |
Idler roller |
D830434, |
Dec 28 2015 |
NTN Corporation |
Inner ring for tapered roller bearing |
D830435, |
Dec 28 2015 |
NTN Corporation |
Inner ring for tapered roller bearing |
D836572, |
Sep 30 2016 |
Applied Materials, Inc.; Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D836573, |
Jan 31 2017 |
HITACHI HIGH-TECH CORPORATION |
Ring for a plasma processing apparatus |
D837755, |
Apr 16 2015 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D839224, |
Dec 12 2016 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing |
D840364, |
Jan 31 2017 |
HITACHI HIGH-TECH CORPORATION |
Electrode cover for a plasma processing apparatus |
D840365, |
Jan 31 2017 |
HITACHI HIGH-TECH CORPORATION |
Cover ring for a plasma processing apparatus |
D847982, |
Feb 04 2016 |
COLOPLAST A S |
Heat exchanger base plate |
D851613, |
Oct 05 2017 |
Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D861757, |
Dec 28 2015 |
NTN Corporation |
Inner ring for tapered roller bearing |
D862404, |
Oct 25 2016 |
DAIKIN FINETECH, LTD |
Sealing material ring for a semiconductor manufacturing apparatus |
D868124, |
Dec 11 2017 |
Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D869409, |
Sep 30 2016 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D870314, |
Aug 31 2017 |
HITACHI HIGH-TECH CORPORATION |
Electrode cover for a plasma processing apparatus |
D871609, |
Aug 31 2017 |
HITACHI HIGH-TECH CORPORATION |
Electrode plate peripheral ring for a plasma processing apparatus |
D877101, |
Mar 09 2018 |
Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D891382, |
Feb 08 2019 |
Applied Materials, Inc |
Process shield for a substrate processing chamber |
D891923, |
Nov 12 2017 |
|
Container lid |
D894137, |
Oct 05 2017 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D902165, |
Mar 09 2018 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D904305, |
Feb 25 2019 |
PETRAM TECHNOLOGIES INC |
Electrode cage for a plasma blasting probe |
D907593, |
Jan 20 2017 |
HITACHI HIGH-TECH CORPORATION |
Discharge chamber for a plasma processing apparatus |
D908645, |
Aug 26 2019 |
Applied Materials, Inc |
Sputtering target for a physical vapor deposition chamber |
D908755, |
Feb 23 2016 |
Joy Global Underground Mining LLC |
Idler roller |
D913977, |
Dec 12 2016 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing |
D916038, |
Mar 19 2019 |
HITACHI HIGH-TECH CORPORATION |
Grounded electrode for a plasma processing apparatus |
D920521, |
May 08 2019 |
|
Double coil |
D922589, |
Sep 08 2020 |
|
Coil |
D926996, |
May 14 2019 |
|
Coil |
D933725, |
Feb 08 2019 |
Applied Materials, Inc |
Deposition ring for a substrate processing chamber |
D933726, |
Jul 31 2020 |
Applied Materials, Inc |
Deposition ring for a semiconductor processing chamber |
D934315, |
Mar 20 2020 |
Applied Materials, Inc |
Deposition ring for a substrate processing chamber |
D937329, |
Mar 23 2020 |
Applied Materials, Inc |
Sputter target for a physical vapor deposition chamber |
D940765, |
Dec 02 2020 |
Applied Materials, Inc |
Target profile for a physical vapor deposition chamber target |
D943539, |
Mar 19 2020 |
Applied Materials, Inc |
Confinement plate for a substrate processing chamber |
D946638, |
Dec 11 2017 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D954986, |
Oct 18 2019 |
HITACHI HIGH-TECH CORPORATION |
Electrode cover for a plasma processing device |
D966357, |
Dec 02 2020 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target |
D970020, |
May 09 2019 |
|
Double coil |
D970566, |
Mar 23 2020 |
Applied Materials, Inc. |
Sputter target for a physical vapor deposition chamber |
D971167, |
Aug 28 2019 |
Applied Materials, Inc. |
Lower shield for a substrate processing chamber |
D979080, |
Jun 27 2019 |
|
MRI tower coil stand |
D979524, |
Mar 19 2020 |
Applied Materials, Inc |
Confinement liner for a substrate processing chamber |
D980394, |
Apr 01 2020 |
WATERMANN POLYWORKS GMBH |
Sealing apparatus |
D981459, |
Jun 16 2021 |
Ebara Corporation |
Retaining ring for substrate |
D986190, |
Mar 19 2020 |
Applied Materials, Inc. |
Confinement plate for a substrate processing chamber |
D989012, |
Sep 17 2020 |
Ebara Corporation |
Elastic membrane |
ER1832, |
|
|
|
ER287, |
|
|
|
ER3866, |
|
|
|
ER4518, |
|
|
|
ER6877, |
|
|
|
ER6966, |
|
|
|
ER8863, |
|
|
|
Patent |
Priority |
Assignee |
Title |
6495007, |
Sep 08 1998 |
ACM RESEARCH, INC |
Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workplaces |
6663762, |
Jul 15 1996 |
Semitool, Inc. |
Plating system workpiece support having workpiece engaging electrode |
6843894, |
Dec 18 1997 |
Semitool, Inc. |
Cathode current control system for a wafer electroplating apparatus |
6908540, |
Jul 13 2001 |
Applied Materials, Inc. |
Method and apparatus for encapsulation of an edge of a substrate during an electro-chemical deposition process |
7025862, |
Oct 22 2002 |
Applied Materials |
Plating uniformity control by contact ring shaping |
7087144, |
Jan 31 2003 |
Applied Materials, Inc.; Applied Materials, Inc |
Contact ring with embedded flexible contacts |
7138039, |
Jan 21 2003 |
Applied Materials, Inc. |
Liquid isolation of contact rings |
D404370, |
Aug 20 1997 |
Tokyo Electron Limited |
Cap for use in a semiconductor wafer heat processing apparatus |
D404372, |
Aug 20 1997 |
Tokyo Electron Limited |
Ring for use in a semiconductor wafer heat processing apparatus |
D427570, |
Jan 31 1997 |
Tokyo Electron Limited |
Quartz fin heat retaining tube |
D494551, |
Dec 12 2002 |
Tokyo Electron Limited |
Exhaust ring for manufacturing semiconductors |
D494552, |
Dec 12 2002 |
Tokyo Electron Limited |
Exhaust ring for manufacturing semiconductors |
D557226, |
Aug 25 2005 |
HITACHI HIGH-TECH CORPORATION |
Electrode cover for a plasma processing apparatus |
D559993, |
Mar 30 2005 |
Tokyo Electron Limited |
Cover ring |
D559994, |
Mar 30 2005 |
Tokyo Electron Limited |
Cover ring |
D699200, |
Sep 30 2011 |
Tokyo Electron Limited |
Electrode member for a plasma processing apparatus |
D709536, |
Sep 30 2011 |
Tokyo Electron Limited |
Focusing ring |
D709538, |
Sep 30 2011 |
Tokyo Electron Limited |
Focusing ring |
D709539, |
Sep 30 2011 |
Tokyo Electron Limited |
Focusing ring |
JP1184862, |
|
|
|
JP1208795, |
|
|
|
JP1210214, |
|
|
|
JP1267920, |
|
|
|
JP1438663, |
|
|
|
JP1444749, |
|
|
|
JP1444992, |
|
|
|