FIG. 1 is an enlarged top isometric view of a deposition ring for a semiconductor processing chamber, according to the first embodiment of the novel design.
FIG. 2 is a front elevation view thereof.
FIG. 3 is a back elevation view thereof.
FIG. 4 is a right elevation view thereof.
FIG. 5 is a left elevation view thereof.
FIG. 6 is a top plan view thereof.
FIG. 7 is a bottom plan view thereof.
FIG. 8 is an enlarged cross-sectional view thereof, taken along line 6-6 of FIG. 6.
FIG. 9 is an enlarged top isometric view of a deposition ring for a semiconductor processing chamber, according to the second embodiment of the novel design.
FIG. 10 is a front elevation view thereof.
FIG. 11 is a back elevation view thereof.
FIG. 12 is a right elevation view thereof.
FIG. 13 is a left elevation view thereof.
FIG. 14 is a top plan view thereof.
FIG. 15 is a bottom plan view thereof.
FIG. 16 is an enlarged cross-sectional view thereof, taken along line 16-16 of FIG. 14; and,
FIG. 17 is an enlarged cross-sectional view thereof, taken along line 17-17 of FIG. 14.
The dashed lines in FIGS. 1-9 represent unclaimed environment forming no part of the claimed design.
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