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The ornamental design for a high conductance low wall deposition upper shield, as shown and described. |
FIG. 1 is a perspective view showing the top of a shield of the invention;
FIG. 2 is a perspective view showing the bottom of a shield of the invention;
FIG. 3 is a top view;
FIG. 4 is a bottom view;
FIG. 5 is a side perspective view; and,
FIG. 6 is a cross sectional view along line 6--6 of FIG. 3.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 05 1997 | Applied Materials, Inc. | (assignment on the face of the patent) | / | |||
Aug 05 1997 | OR, DAVID TSUENEWAI | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008648 | /0607 |
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