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Patent
D891382
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Priority
Feb 08 2019
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Filed
Feb 08 2019
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Issued
Jul 28 2020
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Expiry
Jul 28 2035
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Assg.orig
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Entity
unknown
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34
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21
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n/a
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The ornamental design for a process shield for a substrate processing chamber, as shown and described.
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FIG. 1 is a top isometric view of a process shield for a substrate processing chamber, showing our new design;
FIG. 2 is a bottom isometric view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a front elevation view thereof;
FIG. 6 is a back elevation view thereof;
FIG. 7 is a left side elevation view thereof;
FIG. 8 is a right side elevation view thereof; and,
FIG. 9 is an enlarged cross sectional view taken along line 9-9 in FIG. 3.
The dashed lines in FIGS. 1-9 represent unclaimed environment forming no part of the claimed design.
Sansoni, Steven V., Koppa, Manjunatha P., Kamath, Aravind, Tsai, Cheng-Hsiung Matt, Venkataswamappa, Manjunath H., Or, David
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Jan 30 2020 |
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Handheld sprayer |
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Mar 19 2020 |
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Apr 01 2020 |
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Confinement plate for a substrate processing chamber |
ER1483, |
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ER1922, |
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ER2449, |
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ER2608, |
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ER511, |
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ER6877, |
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Tokyo Electron Limited |
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Mar 30 2005 |
Tokyo Electron Limited |
Cover ring |
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HITACHI HIGH-TECH CORPORATION |
Electrode cover for a plasma processing apparatus |
D797691, |
Apr 14 2016 |
Applied Materials, Inc |
Composite edge ring |
D810705, |
Apr 01 2016 |
VEECO INSTRUMENTS, INC |
Self-centering wafer carrier for chemical vapor deposition |
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Jul 26 2016 |
KOKUSAI ELECTRIC CORPORATION |
Cover of seal cap for reaction chamber of semiconductor |
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Jan 31 2017 |
HITACHI HIGH-TECH CORPORATION |
Electrode cover for a plasma processing apparatus |
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Jan 31 2017 |
HITACHI HIGH-TECH CORPORATION |
Electrode cover for a plasma processing apparatus |
D855027, |
Jan 22 2018 |
KOKUSAI ELECTRIC CORPORATION |
Cover of seal cap for reaction chamber of semiconductor |
D862404, |
Oct 25 2016 |
DAIKIN FINETECH, LTD |
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HITACHI HIGH-TECH CORPORATION |
Electrode cover for a plasma processing apparatus |
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Aug 09 2017 |
KOKUSAI ELECTRIC CORPORATION |
Cover of seal cap for reaction chamber for semiconductor manufacturing |
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Apr 03 2017 |
ASM IP Holding B.V.; ASM IP HOLDING B V |
Exhaust flow control ring for semiconductor deposition apparatus |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 08 2019 | | Applied Materials, Inc. | (assignment on the face of the patent) | | / |
Feb 20 2019 | KOPPA, MANJUNATHA P | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 048612 | /0536 |
pdf |
Feb 20 2019 | H V, MANJUNATH | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 048612 | /0536 |
pdf |
Feb 20 2019 | SANSONI, STEVEN V | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 048612 | /0536 |
pdf |
Feb 20 2019 | OR, DAVID | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 048612 | /0536 |
pdf |
Feb 25 2019 | TSAI, CHENG-HSIUNG MATT | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 048612 | /0536 |
pdf |
Feb 28 2019 | KAMATH, ARAVIND | Applied Materials, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 048612 | /0536 |
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Date |
Maintenance Fee Events |
n/a
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Maintenance Schedule |
n/a