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The ornamental design for an electrode cover for a plasma processing apparatus, as shown and described.
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This application contains subject matter related to the following co-pending U.S. design patent applications:
Application Ser. No. 29/635,287, filed herewith and entitled “Electrode Plate for a Plasma Processing Apparatus”;
Application Ser. No. 29/635,289, filed herewith and entitled “Gas Ring for a Plasma Processing Apparatus”; and
Application Ser. No. 29/635,296, filed herewith and entitled “Electrode Plate Peripheral Ring for a Plasma Processing Apparatus”.
The broken lines show the boundary of enlarged portions and form no part of the claimed design.
Mori, Masahito, Yokogawa, Kenetsu, Arase, Takao, Isozaki, Masakazu, Sakai, Yousuke
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jan 30 2018 | Hitachi High-Technologies Corporation | (assignment on the face of the patent) | / | |||
| Jun 13 2018 | ISOZAKI, MASAKAZU | Hitachi High-Technologies Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 046562 | /0692 | |
| Jun 13 2018 | MORI, MASAHITO | Hitachi High-Technologies Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 046562 | /0692 | |
| Jun 13 2018 | ARASE, TAKAO | Hitachi High-Technologies Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 046562 | /0692 | |
| Jun 14 2018 | YOKOGAWA, KENETSU | Hitachi High-Technologies Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 046562 | /0692 | |
| Jun 14 2018 | SAKAI, YOUSUKE | Hitachi High-Technologies Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 046562 | /0692 | |
| Feb 12 2020 | Hitachi High-Technologies Corporation | HITACHI HIGH-TECH CORPORATION | CHANGE OF NAME AND ADDRESS | 052259 | /0227 |
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