Patent
   D709538
Priority
Sep 30 2011
Filed
Mar 29 2012
Issued
Jul 22 2014
Expiry
Jul 22 2028
Assg.orig
Entity
unknown
24
34
n/a
The ornamental design for a focusing ring, as shown and described.

FIG. 1 is a front view of a focusing ring of the present invention.

FIG. 2 is a right side view of the focusing ring of FIG. 1.

FIG. 3 is a top plan view of the focusing ring of FIG. 1.

FIG. 4 is a bottom view of the focusing ring of FIG. 1.

FIG. 5 is an enlarged sectional view of the 1-3 intersection of lines 1 and 3 of the focusing ring of FIG. 3.

FIG. 6 is an enlarged sectional view of the 2-3 intersection of lines 2 and 3 of the focusing ring of FIG. 3; and,

FIG. 7 is a perspective view of the focusing ring of FIG. 1.

The rear view is the same as the front view.

The left side view is the same as the right side view.

Mizukami, Shunsuke

Patent Priority Assignee Title
11581166, Jul 31 2020 Applied Materials, Inc Low profile deposition ring for enhanced life
D741823, Jul 10 2013 KOKUSAI ELECTRIC CORPORATION Vaporizer for substrate processing apparatus
D766849, May 15 2013 Ebara Corporation Substrate retaining ring
D770992, Jun 12 2015 HITACHI HIGH-TECH CORPORATION Electrode cover for a plasma processing apparatus
D793976, May 15 2013 Ebara Corporation Substrate retaining ring
D795208, Aug 18 2015 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
D797691, Apr 14 2016 Applied Materials, Inc Composite edge ring
D802472, Aug 06 2015 Pall Corporation Electrostatic chuck for semiconductor manufacturing equipment
D803802, Aug 18 2015 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
D803917, Jun 16 2015 KOKUSAI ELECTRIC CORPORATION Heat reflector for substrate processing apparatus
D804556, Jun 16 2015 KOKUSAI ELECTRIC CORPORATION Heat reflector for substrate processing apparatus
D810705, Apr 01 2016 VEECO INSTRUMENTS, INC Self-centering wafer carrier for chemical vapor deposition
D827592, Jan 31 2017 HITACHI HIGH-TECH CORPORATION Electrode cover for a plasma processing apparatus
D839224, Dec 12 2016 Ebara Corporation Elastic membrane for semiconductor wafer polishing
D840364, Jan 31 2017 HITACHI HIGH-TECH CORPORATION Electrode cover for a plasma processing apparatus
D900176, Mar 19 2019 MakerBot Industries, LLC Spool for filament of a three-dimensional printer
D900178, Mar 20 2019 MakerBot Industries, LLC Spool for filament of a three-dimensional printer
D913977, Dec 12 2016 Ebara Corporation Elastic membrane for semiconductor wafer polishing
D933725, Feb 08 2019 Applied Materials, Inc Deposition ring for a substrate processing chamber
D933726, Jul 31 2020 Applied Materials, Inc Deposition ring for a semiconductor processing chamber
D934315, Mar 20 2020 Applied Materials, Inc Deposition ring for a substrate processing chamber
D943539, Mar 19 2020 Applied Materials, Inc Confinement plate for a substrate processing chamber
D979524, Mar 19 2020 Applied Materials, Inc Confinement liner for a substrate processing chamber
D986190, Mar 19 2020 Applied Materials, Inc. Confinement plate for a substrate processing chamber
Patent Priority Assignee Title
6068441, Nov 21 1997 ASM America, Inc Substrate transfer system for semiconductor processing equipment
6815352, Nov 09 1999 Shin-Etsu Chemical Co., Ltd. Silicon focus ring and method for producing the same
6818097, Apr 22 2002 Nisshinbo Industries, Inc Highly heat-resistant plasma etching electrode and dry etching device including the same
7001482, Nov 12 2003 Tokyo Electron Limited Method and apparatus for improved focus ring
7479304, Feb 14 2002 Applied Materials, Inc Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate
8357263, Oct 05 2010 Skyworks Solutions, Inc Apparatus and methods for electrical measurements in a plasma etcher
20030066484,
20040025788,
20040056017,
D363464, Aug 27 1992 Tokyo Electron Limited Electrode for a semiconductor processing apparatus
D404370, Aug 20 1997 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
D404372, Aug 20 1997 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
D494552, Dec 12 2002 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
D496008, Dec 12 2002 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
D546784, Sep 29 2005 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
D548705, Sep 29 2005 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
D556704, Aug 25 2005 HITACHI HIGH-TECH CORPORATION Grounded electrode for a plasma processing apparatus
D557226, Aug 25 2005 HITACHI HIGH-TECH CORPORATION Electrode cover for a plasma processing apparatus
D559993, Mar 30 2005 Tokyo Electron Limited Cover ring
D559994, Mar 30 2005 Tokyo Electron Limited Cover ring
D568693, Feb 09 2007 Rubbermaid Incorporated Food storage container
D606952, Jan 16 2009 ASM KOREA LTD Plasma inducing plate for semiconductor deposition apparatus
D609652, Jul 22 2008 Tokyo Electron Limited Wafer attracting plate
D609655, Oct 03 2008 NGK Insulators, Ltd. Electrostatic chuck
D614593, Jul 21 2008 ASM KOREA LTD Substrate support for a semiconductor deposition apparatus
D648289, Oct 21 2010 Novellus Systems, Inc Electroplating flow shaping plate having offset spiral hole pattern
D654883, Oct 21 2010 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
D654884, Oct 21 2010 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
D655257, Oct 21 2010 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
D655259, Oct 21 2010 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
D694790, Sep 20 2011 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
D697038, Sep 20 2011 Tokyo Electron Limited Baffle plate
TW201001525,
TW471052,
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 29 2012Tokyo Electron Limited(assignment on the face of the patent)
Apr 16 2012MIZUKAMI, SHUNSUKETokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0282480926 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule