PTO Wrapper PDF
Dossier Espace Google
Patent
   D548705
Priority
Sep 29 2005
Filed
Dec 19 2005
Issued
Aug 14 2007
Expiry
Aug 14 2021
Inventors
Hayashi, D…
Assg.orig
Tokyo Elec…
Assg.curr
Tokyo Elec…
Entity
unknown
Referenced by
65
References
18
Maint.:
n/a
The ornamental design for an attracting disc for an electrostatic chuck for semiconductor production, as shown and described.

FIG. 1 is a front elevational view of an attracting disc for an electrostatic chuck for semiconductor production, showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.
INVENTORS:

Hayashi, Daisuke

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
10014170, May 14 2015 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
10053792, Sep 12 2011 Novellus Systems, Inc. Plating cup with contoured cup bottom
10094034, Aug 28 2015 Lam Research Corporation Edge flow element for electroplating apparatus
10190230, Jul 02 2010 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
10233556, Jul 02 2010 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
10301739, May 01 2013 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
10364505, May 24 2016 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
10662545, Dec 12 2012 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
10781527, Sep 18 2017 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
10923340, May 14 2015 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
11001934, Aug 21 2017 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
11047059, May 24 2016 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
8308931, Aug 16 2006 Novellus Systems, Inc Method and apparatus for electroplating
8475636, Nov 07 2008 Novellus Systems, Inc Method and apparatus for electroplating
8475644, Mar 27 2000 Novellus Systems, Inc. Method and apparatus for electroplating
8540857, Dec 19 2008 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
8623193, Jun 16 2004 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
8795480, Jul 02 2010 Novellus Systems, Inc Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
9309604, Nov 07 2008 Novellus Systems, Inc. Method and apparatus for electroplating
9394620, Jul 02 2010 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
9449808, May 29 2013 Novellus Systems, Inc. Apparatus for advanced packaging applications
9464361, Jul 02 2010 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
9512538, Sep 12 2011 Novellus Systems, Inc Plating cup with contoured cup bottom
9523155, Dec 12 2012 Novellus Systems, Inc Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
9624592, Jul 02 2010 Novellus Systems, Inc Cross flow manifold for electroplating apparatus
9670588, May 01 2013 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
9816194, Mar 19 2015 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
9834852, Dec 12 2012 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
9899230, May 29 2013 Novellus Systems, Inc. Apparatus for advanced packaging applications
D570310, Aug 01 2006 Tokyo Electron Limited Attracting plate of an electrostatic chuck for semiconductor manufacturing
D587222, Aug 01 2006 Tokyo Electron Limited; SUMITOMO OSAKA CEMENT CO , LTD Attracting plate of an electrostatic chuck for semiconductor manufacturing
D609652, Jul 22 2008 Tokyo Electron Limited Wafer attracting plate
D609655, Oct 03 2008 NGK Insulators, Ltd. Electrostatic chuck
D648289, Oct 21 2010 Novellus Systems, Inc Electroplating flow shaping plate having offset spiral hole pattern
D650344, Oct 20 2008 Ebara Corporation Vacuum contact pad
D654033, Jan 20 2010 CELADON SYSTEMS, INC Grooved wire support for a probe test core
D674759, Aug 19 2010 EPISTAR CORPORATION Wafer carrier
D689032, Apr 21 2011 Panasonic Corporation Electrostatic atomized water particle generating module
D689835, Jan 08 2013 DIABLO CAPITAL, INC Electrostatic carrier tray
D699199, Sep 30 2011 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
D699200, Sep 30 2011 Tokyo Electron Limited Electrode member for a plasma processing apparatus
D704155, Feb 18 2011 EPISTAR CORPORATION Wafer carrier
D709536, Sep 30 2011 Tokyo Electron Limited Focusing ring
D709537, Sep 30 2011 Tokyo Electron Limited Focusing ring
D709538, Sep 30 2011 Tokyo Electron Limited Focusing ring
D709539, Sep 30 2011 Tokyo Electron Limited Focusing ring
D711330, Dec 28 2010 Ebara Corporation Elastic membrane for semiconductor wafer polishing
D713363, Dec 31 2013 CELADON SYSTEMS, INC Support for a probe test core
D716742, Sep 13 2013 ASM IP Holding B.V. Substrate supporter for semiconductor deposition apparatus
D723077, Dec 03 2013 Applied Materials, Inc Chuck carrier film
D724553, Sep 13 2013 ASM IP Holding B.V. Substrate supporter for semiconductor deposition apparatus
D729753, Dec 28 2010 Ebara Corporation Elastic membrane for semiconductor wafer polishing
D734377, Mar 28 2013 HIRATA CORPORATION Top cover of a load lock chamber
D766849, May 15 2013 Ebara Corporation Substrate retaining ring
D790489, Jul 08 2015 Ebara Corporation Vacuum contact pad
D793976, May 15 2013 Ebara Corporation Substrate retaining ring
D795208, Aug 18 2015 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
D802472, Aug 06 2015 Pall Corporation Electrostatic chuck for semiconductor manufacturing equipment
D803802, Aug 18 2015 Tokyo Electron Limited Electrostatic chuck for semiconductor manufacturing equipment
D858192, Apr 27 2018 Applied Materials, Inc Gas distribution plate
D868993, Aug 31 2017 HITACHI HIGH-TECH CORPORATION Electrode plate for a plasma processing apparatus
D947802, May 20 2020 Applied Materials, Inc Replaceable substrate carrier interfacing film
D984972, Mar 29 2021 BEIJING NAURA MICROELECTRONICS EQUIPMENT CO , LTD Electrostatic chuck for semiconductor manufacture
D988299, Jun 18 2021 Cellular module
D988300, Mar 09 2021 IoT module
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
3078565,
4502094, Sep 14 1981 U S PHILIPS CORPORATION Electrostatic chuck
5350479, Dec 02 1992 Applied Materials, Inc Electrostatic chuck for high power plasma processing
5671116, Mar 10 1995 Lam Research Corporation Multilayered electrostatic chuck and method of manufacture thereof
6033478, Nov 05 1996 Applied Materials, Inc. Wafer support with improved temperature control
6278600, Jan 31 1994 Applied Materials, Inc.; Applied Materials, Inc Electrostatic chuck with improved temperature control and puncture resistance
6628503, Mar 13 2001 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
6721162, Apr 26 1996 Applied Materials Inc. Electrostatic chuck having composite dielectric layer and method of manufacture
20020027762,
20020159217,
20040179323,
20040190215,
20040212947,
20040218339,
20050111161,
20060002053,
20060161785,
20060221539,
ASSIGNMENT RECORDS    Assignment records on the USPTO
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 19 2005Tokyo Electron Limited(assignment on the face of the patent)
Mar 22 2006HAYASHI, DAISUKETokyo Electron LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0177800521 pdf
MAINTENANCE FEES AND DATES:    Maintenance records on the USPTO
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule