The ornamental design for an electrostaticcarriertray, as shown and described.
FIG. 1 is a perspective view of an electrostatic carrier tray showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a right-side elevational view thereof;
FIG. 5 is a left-side elevational view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is an exploded perspective view thereof;
FIG. 9 is a perspective view thereof shown in a used condition wherein a plurality of substrates is electrostatically bonded to the plurality of electrostatic field generating circuits; and,
FIG. 10 is a cross-sectional view thereof taken along line 10-10 of FIG. 7.
The broken lines illustrate the plurality of substrates in FIG. 9 and are included to show environmental structure that forms no part of the claimed design.