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The ornamental design for a frame of dual in line package pads utilized to replace damaged pads on printed circuit boards, as shown and described. |
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The sole FIGURE is a top plan view of the frame of dual in line package pads utilized to replace damaged pads on printed circuit boards showing my new design. The frame is flat with no substantial thickness and the bottom surface is identical to the top.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Feb 15 1984 | WALLGREN, LINUS E | PACE INCORPORATED A DE CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 004233 | /0504 | |
| Feb 21 1984 | Pace, Incorporated | (assignment on the face of the patent) | / | |||
| Mar 26 1985 | PACE INCORPORATED, A CORP OF DELAWARE | PACE, INCORPORATED, A CORP OF MARYLAND | MERGER SEE DOCUMENT FOR DETAILS 5-20-85 | 004489 | /0140 |
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