Patent
   D633880
Priority
Mar 26 2010
Filed
Mar 26 2010
Issued
Mar 08 2011
Expiry
Mar 08 2025
Assg.orig
Entity
unknown
8
27
n/a
The ornamental design for a socket housing, as shown and described.

FIG. 1 is a front perspective view of a socket housing;

FIG. 2 is a front view of the socket housing;

FIG. 3 is a top view of the socket housing;

FIG. 4 is a bottom view of the socket housing;

FIG. 5 is a left side view of the socket housing;

FIG. 6 is a right side view of the socket housing; and,

FIG. 7 is a rear view of the socket housing.

The broken lines showing portions of the socket frame are for illustrative proposes only and form no part of the claimed design.

Dandia, Sanjay, Heng, Stephen, Hardikar, Mahesh, Hassanzadeh, Ali

Patent Priority Assignee Title
D641720, Mar 26 2010 Advanced Micro Devices, INC Circuit package lid
D648688, Mar 26 2010 Advanced Micro Devices, Inc. Socket housing
D658607, Mar 26 2010 Advanced Micro Devices, Inc. Circuit package lid
D661667, Mar 26 2010 Advanced Micro Devices, Inc. Socket assembly
D689835, Jan 08 2013 DIABLO CAPITAL, INC Electrostatic carrier tray
D788722, Jul 17 2014 Advantest Corporation Socket for an electronic device testing apparatus
D819581, Jul 17 2014 Advantest Corporation Socket for electronic device testing apparatus
D845226, Apr 02 2015 Neo Solar Power Corp. Electrode of a solar cell substrate
Patent Priority Assignee Title
4918513, Jun 05 1987 Seiko Epson Corporation Socket for an integrated circuit chip carrier and method for packaging an integrated circuit chip
5486771, Jun 23 1993 Whitaker Corporation Burn-in socket testing apparatus
6746253, Jan 29 2003 Hon Hai Precision Ind. Co., Ltd. LGA socket connector with dual reinforcing members
6805562, Mar 19 2003 Hon Hai Precision Ind. Co., Ltd. Tool for attaching integrated circuit package to electrical connector
7014488, Jul 29 2004 Intel Corporation Socket cover with recessed center and method
7291022, Jun 23 2004 TYCO ELECTRONICS JAPAN G K IC socket
7367815, Jun 05 2006 Hon Hai Precision Inc. Co., Ltd. Electrical socket
7374446, Apr 14 2004 TYCO ELECTRONICS JAPAN G K IC socket
7396248, Sep 13 2007 Hon Hai Precision Ind. Co., Ltd. Land grid array connector with latch portion
7435103, Nov 06 2006 Hon Hai Precision Ind. Co., Ltd. Ball grid array socket having a positioning device
7497743, Jul 31 2007 Electrical connector having elastic arms of terminals extending slantingly upwards
7527503, Jan 18 2008 Hon Hai Precision Ind. Co., Ltd. Socket for integrated circuit with pivotal aligning key
7666020, Jun 25 2007 Hon Hai Precision Ind. Co., Ltd. Land grid array socket with improved fastening structure
7708579, Mar 03 2008 Hon Hai Precision Ind. Co., Ltd. Socket assembly with backplane
7753703, Sep 22 2007 Hon Hai Precision Ind. Co., LTD Insulative housing for configuring socket connector having pivotally mounted clip
7798856, Dec 03 2008 Hon Hai Precision Ind. Co., Ltd. IC socket having positioning means for pick-up cap
20050233629,
20050287837,
20060199413,
20070173081,
20080242138,
20100062623,
D288803, Aug 20 1984 Circuit board cover
D295401, Mar 11 1985 UNION BANK, 942 PACIFIC AVENUE, TACOMA, WASHINGTON 98401, A WA CORP ; DETECTS INC , 100 COMMERCE AVENUE S W , GRAND RAPIDS, MICHIGAN 49503, A MI CORP Electronic circuit board housing
D313686, Nov 24 1986 Northrop Grumman Corporation Integrated circuit chip carrier
D379350, Aug 10 1993 International Business Machines Corporation Expanded jacketted circuit card
D407382, Oct 24 1996 International Business Machines Corporation Lid for a microelectronic package
/////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 26 2010Advanced Micro Devices, Inc.(assignment on the face of the patent)
May 14 2010HENG, STEPHENAdvanced Micro Devices, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0245300577 pdf
May 14 2010HARDIKAR, MAHESHAdvanced Micro Devices, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0245300577 pdf
May 24 2010HASSANZADEH, ALIAdvanced Micro Devices, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0245300577 pdf
May 24 2010DANDIA, SANJAYAdvanced Micro Devices, INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0245300577 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule