We claim the ornamental design for a lid for a microelectronic package, as shown and described.
FIG. 1 is a top plan view of a lid for a microelectronic package showing a
first embodiment of my new design;
FIG. 2 is a side elevational view thereof, the opposite side being
identical in appearance;
FIG. 3 is a bottom plan view thereof; and,
FIG. 4 is a bottom plan view of a lid for a microelectronic package showing
a second embodiment of my new design, the only difference from the first
embodiment residing in the appearance of the bottom.