Patent
   D358805
Priority
Sep 24 1993
Filed
Sep 24 1993
Issued
May 30 1995
Expiry
May 30 2009
Assg.orig
Entity
unknown
7
9
n/a
The ornamental design for the detachable integrated circuit module, as shown and described.

FIG. 1 is a perspective view of the detachable integrated circuit module illustrating its cooperative relationship with a packaged integrated circuit, the broken line showing of the packaged integrated circuit is included for the purpose of illustrating an environmental element only, and forms no part of the claimed design;

FIGS. 2 and 3 are opposing side elevation views of the detachable module;

FIG. 4 is an end elevation view of the detachable module from its end nearer the lockout key;

FIG. 5 is an end elevation view of the detachable module from its end opposite that from the lockout key;

FIG. 6 is a top plan view of the detachable module; and,

FIG. 7 is a bottom plan view of the detachable module.

Siegel, Harry M., Kelappan, Krishnan, Hundt, Michael J.

Patent Priority Assignee Title
9497570, Feb 06 2014 NIMBELINK CORP Embedded wireless modem
D396846, Apr 16 1997 Panasonic Corporation Semiconductor device
D396847, Oct 17 1996 Panasonic Corporation Semiconductor device
D407382, Oct 24 1996 International Business Machines Corporation Lid for a microelectronic package
D522978, Jun 25 2004 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD Information storage semiconductor element
D525214, Jun 25 2004 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD Information storage semiconductor element
D731491, Feb 07 2014 NIMBELINK CORP Embedded cellular modem
Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Sep 21 1993SIEGEL, HARRY MICHAELSGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0067170736 pdf
Sep 21 1993HUNDT, MICHAEL J SGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0067170736 pdf
Sep 21 1993KELAPPAN, KRISHNANSGS-Thomson Microelectronics, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0067170736 pdf
Sep 24 1993SGS-Thomson Microelectronics, Inc.(assignment on the face of the patent)
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