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We claim the ornamental design for an information storage semiconductor element, as shown and described.
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FIG. 1 is a top perspective view of an information storage semiconductor element of the present invention;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a rear view thereof; and,
FIG. 6 is a first side view thereof, wherein the second side view is a mirror image thereof.
Ochi, Takao, Shinyashiki, Junichi
Patent | Priority | Assignee | Title |
D586060, | May 16 2008 | Paint brush holder | |
D591697, | Aug 09 2006 | CREE LED, INC | Lamp package |
D623607, | Sep 17 2007 | CREE LED, INC | Lamp packages |
D658600, | Jun 15 2010 | Toshiba Lighting & Technology Corporation | Light emitting diode module |
D879787, | Nov 21 2017 | Hangzhou Chipjet Technology Co., Ltd. | Data processing equipment |
D880484, | Apr 26 2018 | Hangzhou Chipjet Technology Co., Ltd. | Data processing equipment |
ER5631, | |||
ER6194, |
Patent | Priority | Assignee | Title |
4458291, | Jul 22 1981 | Fujitsu Limited | Package for enclosing semiconductor elements |
5064968, | Jan 16 1990 | Hughes Aircraft Company | Domed lid for integrated circuit package |
5347160, | Sep 28 1992 | Sundstrand Corporation | Power semiconductor integrated circuit package |
5371408, | Nov 29 1991 | Motorola, Inc. | Integrated circuit package with removable shield |
5394009, | Jul 30 1993 | Sun Microsystems, Inc. | Tab semiconductor package with cushioned land grid array outer lead bumps |
6972439, | May 27 2004 | SAMSUNG ELECTRONICS CO , LTD | Light emitting diode device |
20020043707, | |||
20040099874, | |||
206327, | |||
D260091, | Aug 25 1978 | Hitachi, Ltd. | Semiconductor |
D288557, | Sep 10 1984 | Semiconductor Components Industries, LLC | Semiconductor housing |
D319629, | Apr 13 1988 | IBIDEN CO , LTD , A JAPANESE CORP | Semiconductor substrate with conducting pattern |
D345731, | Dec 03 1992 | Freescale Semiconductor, Inc | Semiconductor package |
D358805, | Sep 24 1993 | SGS-Thomson Microelectronics, Inc. | Detachable integrated circuit module |
D396846, | Apr 16 1997 | Panasonic Corporation | Semiconductor device |
D396847, | Oct 17 1996 | Panasonic Corporation | Semiconductor device |
D444132, | Aug 23 2000 | Kabushiki Kaisha Toshiba | Semiconductor element |
D474472, | Jul 15 2002 | Sony Corporation | Information recording medium |
D487430, | Jul 10 2002 | Matsushita Electric Industrial Co., Ltd. | Semiconductor memory element |
JP1136820, | |||
JP1137203, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 17 2004 | OCHI, TAKAO | MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016113 | /0235 | |
Dec 17 2004 | SHINYASHIKI, JUNICHI | MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 016113 | /0235 | |
Dec 20 2004 | Matsushita Electric Industrial Co., Ltd. | (assignment on the face of the patent) | / | |||
Oct 01 2008 | MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD | Panasonic Corporation | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 052184 | /0933 | |
May 21 2020 | Panasonic Corporation | PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 052744 | /0016 |
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