Patent
   D260091
Priority
Aug 25 1978
Filed
Feb 26 1979
Issued
Aug 04 1981
Expiry
Aug 04 1995
Assg.orig
Entity
unknown
22
3
n/a
The ornamental design for a semiconductor, as shown and described.

FIG. 1 is a right side, top and front perspective view of a semiconductor showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;

FIG. 6 is a bottom view thereof;

FIG. 7 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;

FIG. 8 is a bottom view thereof;

FIG. 9 is a right side, top and front perspective view of a semiconductor showing another embodiment of our new design;

FIG. 10 is a bottom view thereof.

Murakami, Gen, Kosaka, Hideki, Mochizuki, Hidetoshi, Otsuki, Keizo

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Patent Priority Assignee Title
3208892,
3436451,
4012766, Aug 28 1973 Western Digital Corporation Semiconductor package and method of manufacture thereof
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Feb 06 1979MOCHIZUKI HIDETOSHIHitachi, LTDASSIGNMENT OF ASSIGNORS INTEREST 0038250585 pdf
Feb 26 1979Hitachi, Ltd.(assignment on the face of the patent)
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