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Patent
D945384
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Priority
Sep 26 2019
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Filed
Mar 25 2020
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Issued
Mar 08 2022
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Expiry
Mar 08 2037
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Assg.orig
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Entity
unknown
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3
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45
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n/a
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The ornamental design for a semiconductor module, as shown and described.
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FIG. 1 is a perspective view of semiconductor module showing my new design;
FIG. 2 is a top view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a front view thereof;
FIG. 5 is a rear view thereof;
FIG. 6 is a right-side view thereof; and,
FIG. 7 is a left-side view thereof.
Yamauchi, Shigeki
Patent |
Priority |
Assignee |
Title |
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6713868, |
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Kabushiki Kaisha Toshiba |
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Kabushiki Kaisha Toshiba |
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Kabushiki Kaisha Toshiba |
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Aug 11 2004 |
DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT |
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Mar 26 2010 |
Advanced Micro Devices, INC |
Socket cap |
D832227, |
Nov 15 2016 |
Rohm Co., Ltd. |
Semiconductor module |
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Nov 15 2016 |
Rohm Co., Ltd. |
Semiconductor module |
D834544, |
Apr 01 2015 |
Infineon Technologies AG |
Semiconductor module |
D834545, |
Apr 01 2015 |
Infineon Technologies AG |
Semiconductor module |
D851611, |
Apr 01 2015 |
Infineon Technologies AG |
Semiconductor module |
D853341, |
Apr 01 2015 |
Infineon Technologies AG |
Semiconductor module |
D859334, |
Oct 26 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
D864135, |
Oct 26 2017 |
Mitsubishi Electric Corporation |
Semiconductor device |
D900759, |
Nov 07 2018 |
ROHM CO , LTD |
Semiconductor device |
D904325, |
Mar 20 2019 |
Sansha Electric Manufacturing Company, Limited |
Semiconductor module |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a