Patent
   D945384
Priority
Sep 26 2019
Filed
Mar 25 2020
Issued
Mar 08 2022
Expiry
Mar 08 2037
Assg.orig
Entity
unknown
3
45
n/a
The ornamental design for a semiconductor module, as shown and described.

FIG. 1 is a perspective view of semiconductor module showing my new design;

FIG. 2 is a top view thereof;

FIG. 3 is a bottom view thereof;

FIG. 4 is a front view thereof;

FIG. 5 is a rear view thereof;

FIG. 6 is a right-side view thereof; and,

FIG. 7 is a left-side view thereof.

Yamauchi, Shigeki

Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 25 2020Lapis Semiconductor Co., Ltd.(assignment on the face of the patent)
Jun 19 2020YAMAUCHI, SHIGEKILAPIS SEMICONDUCTOR CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0572290912 pdf
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