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Patent
   D510728
Priority
Aug 11 2004
Filed
Aug 11 2004
Issued
Oct 18 2005
Expiry
Oct 18 2019
Inventors
Seddon, Mi…
Assg.orig
Semiconduc…
Assg.curr
DEUTSCHE B…
Entity
unknown
Referenced by
30
References
8
Maint.:
n/a
We claim the ornamental design for a semiconductor device package, as shown and described.

FIG. 1 is a perspective view from the front left side and below the semiconductor device package showing our new design.

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof; and,

FIG. 4 is an elevational view from the front side thereof.
INVENTORS:

Seddon, Michael J., Celaya, Phillip, Truhitte, Darrell D.

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
9497570, Feb 06 2014 NIMBELINK CORP Embedded wireless modem
D615506, Jun 23 2009 DBG Group Investments, LLC Integrated energy management system
D675582, Jun 27 2011 UI TECHNOLOGIES, INC Chip assembly
D706733, Sep 16 2013 AIO CORE CO , LTD Signal conversion device
D707193, Sep 16 2013 AIO CORE CO , LTD Signal conversion device
D715234, Apr 18 2013 SemiLEDS Optoelectronics Co., Ltd. Flip chip
D721047, Mar 07 2013 Vicor Corporation Semiconductor device
D731491, Feb 07 2014 NIMBELINK CORP Embedded cellular modem
D732487, Aug 06 2013 EPISTAR CORPORATION Partial semiconductor light emitting component
D732488, Aug 06 2013 EPISTAR CORPORATION Partial semiconductor light emitting component
D752000, Mar 07 2013 Vicor Corporation Semiconductor device
D758329, Aug 06 2013 EPISTAR CORPORATION Partial semiconductor light emitting component
D796459, Apr 11 2016 Rohm Co., Ltd. Packaged semiconductor circuit module
D813182, Aug 02 2016 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD Semiconductor device
D822629, Jan 26 2017 Kyocera Corporation Semiconductor package
D832227, Nov 15 2016 Rohm Co., Ltd. Semiconductor module
D832228, Nov 15 2016 Rohm Co., Ltd. Semiconductor module
D852765, Oct 19 2017 Rohm Co., Ltd. Semiconductor device
D853343, Oct 19 2017 Rohm Co., Ltd. Semiconductor device
D902877, Jun 12 2018 Rohm Co., Ltd. Packaged semiconductor module
D904325, Mar 20 2019 Sansha Electric Manufacturing Company, Limited Semiconductor module
D920265, Sep 29 2019 CHINA CHIPPACKING TECHNOLOGY CO , LTD Integrated circuit package
D920266, Sep 29 2019 CHINA CHIPPACKING TECHNOLOGY CO , LTD Integrated circuit package
D934187, Jan 21 2020 GUANGDONG CHIPPACKING TECHNOLOGY CO , LTD Integrated circuit package
D934821, Jul 24 2019 NUVOTON TECHNOLOGY CORPORATION JAPAN Semiconductor device
D937231, Apr 06 2020 WOLFSPEED, INC Power semiconductor package
D945384, Sep 26 2019 LAPIS SEMICONDUCTOR CO , LTD Semiconductor module
D969762, Apr 06 2020 WOLFSPEED, INC. Power semiconductor package
RE45712, Mar 18 2013 AIO CORE CO , LTD Signal conversion device
RE45741, Mar 18 2013 AIO CORE CO , LTD Signal conversion device
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
6232655, Jan 10 1997 Kabushiki Kaisha Toshiba Semiconductor element having external connection terminals, method of manufacturing the semiconductor element, and semiconductor device equipped with the semiconductor element
D396847, Oct 17 1996 Panasonic Corporation Semiconductor device
D416236, Sep 02 1998 SII CRYSTAL TECHNOLOGY INC Integrated circuit package
D444132, Aug 23 2000 Kabushiki Kaisha Toshiba Semiconductor element
D466873, Oct 31 2001 Siliconix Incorporated Semiconductor chip package
D472528, Oct 31 2001 Siliconix Incorporated Semiconductor chip package
D476962, Mar 29 2002 Kabushiki Kaisha Toshiba Semiconductor device
D489338, Jul 28 2003 DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT Packaged semiconductor device
ASSIGNMENT RECORDS    Assignment records on the USPTO
///////////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 09 2004CELAYA, PHILLIPSemiconductor Components Industries, L L CASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0156860203 pdf
Aug 09 2004SEDDON, MICHAEL J Semiconductor Components Industries, L L CASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0156860203 pdf
Aug 09 2004TRUHITTE, DARRELL D Semiconductor Components Industries, L L CASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0156860203 pdf
Aug 11 2004Semiconductor Components Industries LLC(assignment on the face of the patent)
Jan 18 2005Semiconductor Components Industries, LLCJPMORGAN CHASE BANK, N A ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0161830001 pdf
May 11 2010JPMORGAN CHASE BANK, N A , AS ADMINISTRATIVE AGENT AND COLLATERAL AGENTSemiconductor Components Industries, LLCRELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS 0386310345 pdf
Apr 15 2016JPMORGAN CHASE BANK, N A ON ITS BEHALF AND ON BEHALF OF ITS PREDECESSOR IN INTEREST, CHASE MANHATTAN BANK Semiconductor Components Industries, LLCRELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS 0386320074 pdf
Apr 15 2016Semiconductor Components Industries, LLCDEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENTCORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087 ASSIGNOR S HEREBY CONFIRMS THE SECURITY INTEREST 0398530001 pdf
Apr 15 2016Semiconductor Components Industries, LLCDEUTSCHE BANK AG NEW YORK BRANCHSECURITY INTEREST SEE DOCUMENT FOR DETAILS 0386200087 pdf
Jun 22 2023DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENTSemiconductor Components Industries, LLCRELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 00870640700001 pdf
Jun 22 2023DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENTFairchild Semiconductor CorporationRELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 00870640700001 pdf
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