Semiconductor package

Abstract

Description

FIG. 1 is a top perspective view of a semiconductor package showing our new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is an enlarged portion view labeled 8 taken in FIG. 1;

FIG. 9 is an enlarged portion view labeled 9 taken in FIG. 2; and,

FIG. 10 is another perspective view thereof shown in a used condition in which the semiconductor package is sealed and mounted onto a substrate which is shown in broken lines.

The broken lines in the drawings illustrate portions of the semiconductor package which form no part of the claimed design. The dot-dashed lines in the drawings are for the purpose of showing boundaries of the design and form no part of the claimed design.

Claims

The ornamental design for a semiconductor package, as shown and described.