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The ornamental design for a semiconductor memory element, as shown and described.
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FIG. 1 is a top perspective view of a semiconductor memory element showing our new design;
FIG. 2 is a side elevation view thereof, the opposite side view being a mirror image of that shown;
FIG. 3 is a top plan view thereof;
FIG. 4 is a bottom plan view thereof; and,
FIG. 5 is a front elevation view thereof, the rear elevation view being a mirror image of that shown.
Noda, Takashi, Ochi, Takao, Shinyashiki, Junichi, Asaka, Nobuyoshi
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 02 2002 | ASAKA, NOBUYOSHI | MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013541 | /0928 | |
Sep 02 2002 | NODA, TAKASHI | MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013541 | /0928 | |
Sep 02 2002 | OCHI, TAKAO | MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013541 | /0928 | |
Sep 02 2002 | SHINYASHIKI, JUNICHI | MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013541 | /0928 | |
Nov 27 2002 | Matsushita Electric Industrial Co., Ltd. | (assignment on the face of the patent) | / |
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