Patent
   D577692
Priority
Apr 13 2005
Filed
Feb 19 2008
Issued
Sep 30 2008
Expiry
Sep 30 2022
Assg.orig
Entity
unknown
4
12
n/a
The ornamental design for grooves formed around a semiconductor device on a board, as shown and described.

FIG. 1 shows a plan view of grooves formed around a semiconductor device on a circuit board showing our new design.

FIG. 2 shows an enlarged view of the claimed portion identified by the area boxed by the dot- dash line in FIG. 1; and,

FIG. 3 shows an enlarged sectional view along the line 33 in FIG. 2.

The special dot-dash broken line defines the boundary of the claimed design; the gray stippling indicates the surface of the groove bed; the broken lines show unclaimed subject matter forming no part of the claimed design.

Ohsawa, Tetsuya, Tani, Emiko

Patent Priority Assignee Title
D598380, May 09 2008 FUJIFILM Corporation Conductive sheet
D613690, Dec 09 2008 FUJIFILM Corporation Conductive sheet
D615927, May 09 2008 FUJIFILM Corporation Conductive sheet
D658119, Dec 23 2010 Deutsche Cell GmbH Metallization pattern of a solar cell
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Feb 19 2008Nitto Denko Corporation(assignment on the face of the patent)
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