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Patent
   D598380
Priority
May 09 2008
Filed
Nov 10 2008
Issued
Aug 18 2009
Expiry
Aug 18 2023
Inventors
Kuriki, Ta…
Assg.orig
FUJIFILM C…
Assg.curr
FUJIFILM C…
Entity
unknown
Referenced by
35
References
11
Maint.:
n/a
The ornamental design for a conductive sheet, as shown.

FIG. 1 is a front view of a conductive sheet showing my new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof; and,

FIG. 4 is a right side view thereof.
INVENTORS:

Kuriki, Tadashi

THIS PATENT IS REFERENCED BY THESE PATENTS:
Patent Priority Assignee Title
D613690, Dec 09 2008 FUJIFILM Corporation Conductive sheet
D615378, May 28 2008 Procter & Gamble Company, The Pattern for a sheet
D615927, May 09 2008 FUJIFILM Corporation Conductive sheet
D621803, Jul 16 2008 THE FURUKAWA ELECTRIC CO , LTD Semiconductor wafer processing tape
D625110, May 28 2008 The Procter & Gamble Company Sheet with pattern
D628170, Jul 16 2008 THE FURUKAWA ELECTRIC CO , LTD Semiconductor wafer processing tape
D630859, May 28 2008 The Procter & Gamble Company Sheet material with pattern
D650993, Sep 22 2010 The Procter & Gamble Company Sheet with pattern
D662325, Sep 22 2010 The Procter & Gamble Company Sheet with pattern
D680505, Oct 15 2010 Resonac Corporation Adhesive tape for semiconductor manufacturing
D716241, Jul 11 2013 Sumitomo Electric Printed Circuits, Inc.; Sumitomo Electric Fine Polymer, Inc. Wiring board
D716741, Jul 11 2013 Sumitomo Electric Printed Circuits, Inc.; Sumitomo Electric Fine Polymer, Inc. Wiring board
D734732, Jul 10 2013 Sumitomo Electric Fine Polymer, Inc.; Sumitomo Electric Printed Circuits, Inc. Circuit board material
D743356, Jun 17 2011 KORRUS, INC Diamond-shaped semiconductor die
D774477, Mar 28 2014 ABL IP Holding LLC Conductor pads
D784937, Nov 13 2014 Tokyo Electron Limited Dummy wafer
D785576, Nov 13 2014 Tokyo Electron Limited Dummy wafer
D786810, Nov 13 2014 Tokyo Electron Limited Dummy wafer
D813182, Aug 02 2016 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD Semiconductor device
D822229, Nov 26 2014 durlum Group GmbH Ceiling tile or panel
D822627, Jan 31 2017 Rohm Co., Ltd. Semiconductor device
D822628, Jan 31 2017 Rohm Co., Ltd. Semiconductor device
D823270, Sep 30 2016 Rohm Co., Ltd. Semiconductor device
D844577, Mar 28 2014 ABL IP Holding LLC Conductor pad
D846513, Apr 27 2016 NGK Insulators, Ltd. Sheet heater for electrostatic chuck
D877103, Mar 28 2014 ABL IP Holding LLC Conductor pad
D934820, Oct 24 2019 NUVOTON TECHNOLOGY CORPORATION JAPAN Semiconductor device
D934821, Jul 24 2019 NUVOTON TECHNOLOGY CORPORATION JAPAN Semiconductor device
D937232, Oct 24 2019 NUVOTON TECHNOLOGY CORPORATION JAPAN Semiconductor device
D937233, Oct 24 2019 NUVOTON TECHNOLOGY CORPORATION JAPAN Semiconductor device
D938925, Oct 24 2019 NUVOTON TECHNOLOGY CORPORATION JAPAN Semiconductor device
D951212, Dec 11 2019 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD Semiconductor device
D951213, Dec 11 2019 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD Semiconductor device
D951214, Dec 11 2019 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD Semiconductor device
D951215, Dec 11 2019 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD Semiconductor device
THIS PATENT REFERENCES THESE PATENTS:
Patent Priority Assignee Title
5084958, May 30 1989 Lockheed Martin Corporation Method of making conductive film magnetic components
20010052595,
20070159285,
D319629, Apr 13 1988 IBIDEN CO , LTD , A JAPANESE CORP Semiconductor substrate with conducting pattern
D353135, Nov 27 1991 Gemplus Card International Connecting terminal for chip cards
D393458, Jun 19 1995 Gemplus Connecting terminal for chip cards
D406822, Mar 06 1997 Siemens Aktiengesellschaft Carrier element for a semiconductor chip for integration into a chipcard, or a chipcard module
D419959, Jul 11 1997 TENCO, L L C Conductive ink traces pattern on a medium
D487430, Jul 10 2002 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
D577691, Apr 13 2005 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
D577692, Apr 13 2005 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
ASSIGNMENT RECORDS    Assignment records on the USPTO
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 21 2008KURIKI, TADASHIFUJIFILM CorporationCORRECTIVE ASSIGNMENT TO CORRECT THE ADDRESS OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 021809 FRAME 0217 ASSIGNOR S HEREBY CONFIRMS THE THE STREET NUMBER SHOULD HAVE BEEN 26-30 RATHER THAN 23-30 0222180209 pdf
Oct 21 2008KURIKI, TADASHIFUJIFILM CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0218090217 pdf
Nov 10 2008FUJIFILM Corporation(assignment on the face of the patent)
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