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The ornamental design for a semiconductor substrate with conducting pattern, as shown. |
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FIG. 1 is a top perspective view of a semi-conductor mounting device showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a rear elevational view thereof; and
FIG. 6 is a front elevational view thereof;
FIG. 7 is a top plan view thereof; and
FIG. 8 is a bottom plan view thereof.
Hasegawa, Terutomi, Goto, Nobumichi
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Apr 13 1988 | Ibiden Co., Ltd. | (assignment on the face of the patent) | / | |||
| Nov 11 1990 | HASEGAWA, TERUTOMI | IBIDEN CO , LTD , A JAPANESE CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 005554 | /0906 | |
| Nov 11 1990 | GOTO, NOBUMICHI | IBIDEN CO , LTD , A JAPANESE CORP | ASSIGNMENT OF ASSIGNORS INTEREST | 005554 | /0906 |
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