Patent
   D319629
Priority
Apr 13 1988
Filed
Apr 13 1988
Issued
Sep 03 1991
Expiry
Sep 03 2005

TERM.DISCL.
Assg.orig
Entity
unknown
96
19
n/a
The ornamental design for a semiconductor substrate with conducting pattern, as shown.

FIG. 1 is a top perspective view of a semi-conductor mounting device showing our new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a rear elevational view thereof; and

FIG. 6 is a front elevational view thereof;

FIG. 7 is a top plan view thereof; and

FIG. 8 is a bottom plan view thereof.

Hasegawa, Terutomi, Goto, Nobumichi

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Apr 13 1988Ibiden Co., Ltd.(assignment on the face of the patent)
Nov 11 1990HASEGAWA, TERUTOMIIBIDEN CO , LTD , A JAPANESE CORP ASSIGNMENT OF ASSIGNORS INTEREST 0055540906 pdf
Nov 11 1990GOTO, NOBUMICHIIBIDEN CO , LTD , A JAPANESE CORP ASSIGNMENT OF ASSIGNORS INTEREST 0055540906 pdf
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