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Patent
D821337
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Priority
Jan 20 2015
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Filed
Jan 20 2015
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Issued
Jun 26 2018
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Expiry
Jun 26 2032
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Assg.orig
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Entity
unknown
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5
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9
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n/a
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The ornamental design for a contact field for a printed circuit board, substantially as shown and described.
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FIG. 1 is a top perspective view of a contact field for a printed circuit board;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a right side elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a front elevation view thereof;
FIG. 6 is a rear elevation view thereof;
FIG. 7 is a top plan view thereof;
FIG. 8 is a bottom plan view thereof;
FIG. 9 is a first close up bottom plan view thereof; and,
FIG. 10 is a second close up bottom plan view thereof.
The broken lines shown represent portions of the contact field for a printed circuit board that form no part of the claimed design.
Lewis, Jack, Adams, Lynwood Dale
Patent |
Priority |
Assignee |
Title |
4330684, |
Dec 27 1977 |
|
Matrix board |
5159536, |
May 13 1988 |
Fleet Capital Corporation |
Panel board |
5296652, |
May 03 1991 |
Lockheed Martin Corp |
Apparatus for attaching a circuit component to a printed circuit board |
6255600, |
Feb 28 1995 |
The Board of Trustees of the University of Arkansas |
Electronic interconnection medium having offset electrical mesh plane |
7012196, |
Jun 05 2002 |
|
Apparatus, method and system for interfacing electronic circuits |
D319629, |
Apr 13 1988 |
IBIDEN CO , LTD , A JAPANESE CORP |
Semiconductor substrate with conducting pattern |
D334175, |
Apr 12 1991 |
K & S INTERCONNECT, INC |
Probe interface test board |
D457146, |
Nov 29 2000 |
Kabushiki Kaisha Kaisha Toshiba |
Substrate for a semiconductor element |
D465772, |
Apr 20 2001 |
Hewlett Packard Enterprise Development LP |
Printed circuit board |
Date |
Maintenance Fee Events |
n/a
Date |
Maintenance Schedule |
n/a