Patent
   D465772
Priority
Apr 20 2001
Filed
Sep 28 2001
Issued
Nov 19 2002
Expiry
Nov 19 2016
Assg.orig
Entity
unknown
22
10
n/a
The ornamental design of a printed circuit board, as shown in the Figures.

FIG. 1 is a three-quarter view of the printed circuit board;

FIG. 2 is a plan view from above of the printed circuit board;

FIG. 3 is a plan view from below of the printed circuit board;

FIG. 4 is a first side view of the printed circuit board;

FIG. 5 is a first end view of the printed circuit board;

FIG. 6 is a second end view of the printed circuit board; and,

FIG. 7 is a second side view of the printed circuit board.

Donoghue, Bryan J, Law, David J, Turner, Edward, Poulter, Alan R, Bayfield, Richard N, Bobbitt, Mark A

Patent Priority Assignee Title
D503688, Jul 03 2002 DYNA Systems GmbH Electrical logic element with relief symbol
D601978, Jan 09 2008 KONICA MINOLTA, INC Printed circuit board
D608824, Jan 09 2008 KONICA MINOLTA, INC Print head for an ink jet printer
D680978, Apr 07 2011 Low drag antenna board
D742338, Aug 27 2014 Apple Inc MLB module for electronic device
D753073, Dec 30 2014 GN AUDIO A S Printed circuit board
D757666, Oct 16 2014 Japan Aviation Electronics Industry, Limited Flexible printed circuit
D798251, Nov 07 2016 Transcend Information, Inc. Printed circuit board of solid-state memory
D821337, Jan 20 2015 MODUS TEST, LLC Contact field for a printed circuit board
D821338, Jan 20 2015 MODUS TEST, LLC Contact fields for a printed circuit board
D821987, Apr 27 2016 NGK Insulators, Ltd. Flexible printed circuits
D843334, May 11 2016 NGK Insulators, Ltd. Flexible printed circuits
D864131, Jun 30 2017 TENKA INC Circuit cube
D875056, Jun 08 2017 Flexible printed circuit board
D882537, Jun 30 2017 Tenka, Inc. Circuit cube
D882538, Jun 30 2017 Tenka Inc. Circuit cube
D886072, Jun 30 2017 Tenka Inc. Circuit cube
D901405, Mar 28 2017 Rohm Co., Ltd. Semiconductor device
D919700, Aug 09 2018 SATO HOLDINGS KABUSHIKI KAISHA; Kyocera Corporation Thermal head for a printer
D936139, Feb 28 2018 SATO HOLDINGS KABUSHIKI KAISHA; Kyocera Corporation Thermal head for a printer
D955905, Dec 08 2020 BEIJING VOYAGER TECHNOLOGY CO., LTD. Light detection and ranging (LIDAR) component
D956705, Nov 07 2019 Lam Research Corporation Cooling plate for a semiconductor processing apparatus
Patent Priority Assignee Title
4330684, Dec 27 1977 Matrix board
4651416, Oct 31 1983 Printed circuits
5023753, Jan 13 1989 Kabushiki Kaisha Toshiba Printed circuit
5148350, Apr 23 1990 Motorola, Inc. Portable electronics apparatus housing and chassis
5296652, May 03 1991 Lockheed Martin Corp Apparatus for attaching a circuit component to a printed circuit board
5321380, Nov 06 1992 Ault Incorporated Low profile printed circuit board
5627726, Aug 07 1995 FEP HOLDING COMPANY Electronic card with printed circuit board as outer surface
6282093, Jun 11 1999 Thomas & Betts International, Inc. LGA clamp mechanism
D255351, Jun 28 1978 Midgard Electronic Company, Inc. Circuit board
D334175, Apr 12 1991 K & S INTERCONNECT, INC Probe interface test board
////////////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 06 2001DONOGHUE, BRYAN JAMES3Com CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0122230671 pdf
Aug 06 2001POULTER, ALAN ROGER3Com CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0122230671 pdf
Aug 06 2001BAYFIELD, RICHARD NEIL3Com CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0122230671 pdf
Aug 13 2001LAW, DAVID JOHN3Com CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0122230671 pdf
Aug 17 2001BOBBITT, MARK ANTHONY3Com CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0122230671 pdf
Sep 04 2001TURNER, EDWARD3Com CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0122230671 pdf
Sep 28 20013Com Corporation(assignment on the face of the patent)
Jan 31 2003Hewlett-Packard CompanyHEWLETT-PACKARD DEVELOPMENT COMPANY, L P ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0273290044 pdf
Apr 28 20103Com CorporationHewlett-Packard CompanyMERGER SEE DOCUMENT FOR DETAILS 0246300820 pdf
Apr 28 20103Com CorporationHewlett-Packard CompanyCORRECTIVE ASSIGNMENT TO CORRECT THE SEE ATTACHED0250390844 pdf
Oct 10 2011Hewlett-Packard CompanyHEWLETT-PACKARD DEVELOPMENT COMPANY, L P CORRECTIVE ASSIGNMENT PREVIUOSLY RECORDED ON REEL 027329 FRAME 0001 AND 0044 0289110846 pdf
Oct 27 2015HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Hewlett Packard Enterprise Development LPASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0370790001 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule