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The ornamental design of a printed circuit board, as shown in the Figures.
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FIG. 1 is a three-quarter view of the printed circuit board;
FIG. 2 is a plan view from above of the printed circuit board;
FIG. 3 is a plan view from below of the printed circuit board;
FIG. 4 is a first side view of the printed circuit board;
FIG. 5 is a first end view of the printed circuit board;
FIG. 6 is a second end view of the printed circuit board; and,
FIG. 7 is a second side view of the printed circuit board.
Donoghue, Bryan J, Law, David J, Turner, Edward, Poulter, Alan R, Bayfield, Richard N, Bobbitt, Mark A
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 06 2001 | DONOGHUE, BRYAN JAMES | 3Com Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012223 | /0671 | |
Aug 06 2001 | POULTER, ALAN ROGER | 3Com Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012223 | /0671 | |
Aug 06 2001 | BAYFIELD, RICHARD NEIL | 3Com Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012223 | /0671 | |
Aug 13 2001 | LAW, DAVID JOHN | 3Com Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012223 | /0671 | |
Aug 17 2001 | BOBBITT, MARK ANTHONY | 3Com Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012223 | /0671 | |
Sep 04 2001 | TURNER, EDWARD | 3Com Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012223 | /0671 | |
Sep 28 2001 | 3Com Corporation | (assignment on the face of the patent) | / | |||
Jan 31 2003 | Hewlett-Packard Company | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 027329 | /0044 | |
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