Patent
   D821338
Priority
Jan 20 2015
Filed
Jan 20 2015
Issued
Jun 26 2018
Expiry
Jun 26 2032
Assg.orig
Entity
unknown
7
9
n/a
The ornamental design for a contact fields for a printed circuit board, substantially as shown and described.

FIG. 1 is a top perspective view of a contact fields for a printed circuit board showing our new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a right side elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a front elevation view thereof;

FIG. 6 is a rear elevation view thereof;

FIG. 7 is a top plan view thereof;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a partial enlarged bottom perspective view thereof; and,

FIG. 10 is a partial enlarged close-up bottom plan view thereof.

The broken lines shown represent portions of the contact fields for a printed circuit board that form no part of the claimed design.

Lewis, Jack, Adams, Lynwood Dale

Patent Priority Assignee Title
D872032, Sep 14 2018 TELIT COMMUNICATIONS S P A Connection module
D872033, Sep 14 2018 TELIT COMMUNICATIONS S P A Connection module
D927429, Mar 15 2019 MODUS TEST, LLC Plurality of contact fields for a printed circuit board
D933016, Mar 15 2019 MODUS TEST, LLC Contact field for a printed circuit board
D937232, Oct 24 2019 NUVOTON TECHNOLOGY CORPORATION JAPAN Semiconductor device
D937233, Oct 24 2019 NUVOTON TECHNOLOGY CORPORATION JAPAN Semiconductor device
D938925, Oct 24 2019 NUVOTON TECHNOLOGY CORPORATION JAPAN Semiconductor device
Patent Priority Assignee Title
4330684, Dec 27 1977 Matrix board
5159536, May 13 1988 Fleet Capital Corporation Panel board
5296652, May 03 1991 Lockheed Martin Corp Apparatus for attaching a circuit component to a printed circuit board
6255600, Feb 28 1995 The Board of Trustees of the University of Arkansas Electronic interconnection medium having offset electrical mesh plane
7012196, Jun 05 2002 Apparatus, method and system for interfacing electronic circuits
D319629, Apr 13 1988 IBIDEN CO , LTD , A JAPANESE CORP Semiconductor substrate with conducting pattern
D334175, Apr 12 1991 K & S INTERCONNECT, INC Probe interface test board
D457146, Nov 29 2000 Kabushiki Kaisha Kaisha Toshiba Substrate for a semiconductor element
D465772, Apr 20 2001 Hewlett Packard Enterprise Development LP Printed circuit board
////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 15 2015ADAMS, LYNWOOD DALEModus Test Automation, LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0347610843 pdf
Jan 15 2015LEWIS, JACKModus Test Automation, LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0347610843 pdf
Jan 20 2015MODUS TEST AUTOMATION, LLC.(assignment on the face of the patent)
Jul 01 2018Modus Test Automation, LLCMODUS TEST, LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0465120876 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule